ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Flip chip (FC) and system-in-package (SiP) assembly remain the mainstream chip packaging technologies, while fan-out (FO) FO packaging was adopted for smartphone APs starting 2017...
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
Taiwan's leading OSAT ASE Technology expects revenues from backend services for automotive chips to break a landmark level of US$1 billion in 2022 after growing 60% on year in 2021...
ESD (electrostatic discharge) protection components have become increasingly crucial peripheral chips for handset and metaverse devices, spurring great demand for micro-packaging...
Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are all poised to see their revenues peak for 2021 in the fourth quarter thanks to strong shipments for fulfilling...
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Taiwan-based Nan Ya PCB is optimistic that its 2022 revenues will register another double-digit growth on new ABF and BT production capacities gradually coming online.
Taiwan-based Nan Ya Plastics has reported its October revenues grew 4.9% sequentially and 51.4% on year reaching a record monthly high of NT$37.45 billion (US$1.343 billion).
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
The sustainability of Moore's Law, an observation made by Gordon Moore in 1965 that the number of transistors on a chip would double every 18 months, has been in the center of debate...
