220 news items tagged SiP
FPCB, SiP substrate makers readying mass production for new AirPods
Friday 26 March 2021Taiwan's PCB makers in the supply chain of AirPods are prepared to kick off mass production of flexible PCB (FPCB) and SiP substrates for the third-generation AirPods slated to be...
ASE starts optical sensors production for next-generation AirPods
Friday 26 March 2021Backend house ASE Technology has kicked off optical sensors production for the next-generation AirPods slated for launch in the third quarter of 2021, according to industry sources...
ASE, ShunSin gearing up for optical module shipment boom
Tuesday 23 March 2021Backend houses ASE Technology and ShunSin Technology are both expected to enjoy a surge in orders for optical communication modules for 5G device applications starting the second...
LG Innotek reportedly bracing for ABF substrate production
Friday 19 March 2021IC substrate maker LG Innotek is bracing for production of ABF-based FCBGA substrates, according to Korean media reports, but industry sources believe it would be a hard job to venture...
Nan Ya to spend NT$8 billion on IC substrate capacity expansion
Friday 5 March 2021Nan Ya PCB has disclosed plans to spend at least NT$8 billion (US$287.5 million) in 2021, compared to a capex of NT$7.35 billion for 2020, for capacity expansions at its plants in...
Wire-bonding capacity to stay short of demand throughout 2021
Friday 5 February 2021ASE Technology Holding will see its wire-bonding capacity run at full utilization and remain short of demand through the end of 2021, and up to 90% of clients have signed two-year...
Taiwan IC substrate makers see promising demand for SiP, AiP designs
Wednesday 20 January 2021Taiwan-based IC substrate makers are generally cautious about expanding BT-based substrate capacity. Nevertheless, with demand for SiP (system-in-package) and AiP (antenna-in-package)...
Nan Ya, Kinsus see 4Q20 revenues peak on strong IC substrate demand
Friday 8 January 2021IC substrate suppliers Nan Ya PCB and Kinsus Interconnect Technology both saw their fourth-quarter 2020 revenues hit the year's peak, bolstered by higher prices offered by clients...
OSE seeking logic chips backend orders after allying with Chipbond
Thursday 7 January 2021Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Customized IC sockets in hot demand for SiP, SLT applications
Thursday 31 December 2020Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration,...
Merry Electronics deepening presence in TWS earbuds market
Tuesday 29 December 2020Taiwan-based acoustic solutions specialist Merry Electronics, now in the supply chain for Apple's AirPods, is gearing up to deepen its deployments also in the non-Apple TWS (true...
Taiwan IC substrate makers doing well in China market
Friday 25 December 2020Taiwan's IC substrate makers Unmicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology have seen their production lines in China running at full capacity to serve Chinese...
Xintec, ShunSin see robust backend orders
Tuesday 8 December 2020Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...
Shunsin to start commercial runs at new Vietnam plants in 2021
Friday 20 November 2020Backend house ShunSin Technology, a subsidiary of Foxconn Technology, is set to start commercial production at its new plants in Vietnam 2021, mainly to fulfill orders from US clients,...
ASE quietly enhancing CIS backend capability
Monday 16 November 2020ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
Top foundries to maintain tight partnerships with OSATs, says Amkor executive
Monday 9 November 2020Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
IC substrate maker Kinsus to see revenue peak in 4Q20
Thursday 29 October 2020IC substrate maker Kinsus Interconnect Technology is set to see its revenues peak for 2020 in the fourth quarter, buoyed by shipments for new iPhones, according to market sources.
Taiwan makers urged to build high-end IC substrate ecosystem
Monday 26 October 2020A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Tuesday 20 October 2020Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
IC substrate suppliers eyeing strong SiP demand for AirPods
Friday 16 October 2020The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to...
Quartz component demand for AirPods to grow robustly in 2021
Friday 16 October 2020Apple reportedly will have its next-generation AirPods series all adopt system-in-package (SiP) technology, which will significantly boost overall quartz component demand for the...
ASE provides SiP packaging for Apple-designed UWB chip
Thursday 15 October 2020Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...
Nan Ya PCB, Kinsus post record revenues for 3Q20
Thursday 8 October 2020IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology have reported impressive revenue increases for the third quarter of 2020 on strong shipments of diverse substrate...
Taiwan makers to supply all SiP substrates for new Apple Watch
Thursday 17 September 2020SiP substrates adopted for processing core processors and peripheral components for new Apple Watch models reportedly will be all supplied by three Taiwanese makers, Unimicron Technology,...
ASE Technology reportedly lands major SiP orders for new Apple Watch
Thursday 17 September 2020ASE Technology and its EMS subsidiary Universal Scientific Industrial (USI) have reportedly grabbed major system-in-package (SiP) orders for the new Apple Watch Series 6 and Apple...