ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...

Foxconn Technology Group will step up transforming into a provider of technology services by deepening deployments in electric vehicle, smart heath care and robot industries while...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, has reported net profit shot up 115.7% sequentially to a 13-quarter high of NT$268 million (US$8.78 million)...

GaAs IC foundries including Advanced Wireless Semiconductor (AWSC) and Win Semiconductors have both seen their 6-inch fab capacity utilization rates ramp up, driven by robust demand...

Global shipments of TWS (true wireless stereo) earphones are expected to surge sharply to 150-200 million sets in 2020 from around 100 million sets estimated for 2019, providing strong...

Global chipmakers are keenly developing Wi-Fi 6 chip solutions to support sub-6-GHz 5G smartphones, the mainstream new-generation models estimated to register annual shipments of...

IC backend house ASE Technology Holding expects to enjoy a better-than-regular performance for the first quarter of 2020 thanks to strong high-end chips packaging orders for 5G phones,...

Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt...

China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...

Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...

ASE Technology is expected to see its revenues grow quarter by quarter into 2020 thanks to strong packaging demand from major clients including Apple, Huawei's HiSilicon, MediaTek...

US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging equipment.

Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...

Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...

The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and...

Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...

IC backend house ASE Technology Holding is expected to generate sequential revenue increases through the last quarter of 2019, driven by orders for SoC chips for smartphones, wearables...

ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, is expected to see revenues and profits hit the year's highs in September and October, bolstered by robust...

Taiwan's top backend house Advanced Semiconductor Engineering (ASE) has decided to purchase a new factory building in Kaohsiung, southern Taiwan to provide more space for warehousing...

With Qualcomm aggressively offering multiple APs, baseband chips and RF front-end modules (FEMs) to tap the 5G smartphone market, its Taiwan-based backend service providers including...

MediaTek has placed backend orders with Amkor Technology for its new 7nm SoC designed for low-band (sub-6GHz) 5G handsets, according to industry sources.

Taiwan's top IC backend specialist ASE Technology Holding has seen its SiP (system in package) business expand substantially so far this year amid growing demand for heterogeneous...

As shipments of 5G network equipment and terminal devices are set to trend up steadily, major global chipmakers are all gearing up for close combats in the 5G chipset market by releasing...

Taiwan's makers of ABF-based IC substrates including Unimicron and Nan Ya PCB will see full capacity utilization for the product line through the second half of 2019 mainly thanks...