Taiwan-based IC substrate makers are generally cautious about expanding BT-based substrate capacity. Nevertheless, with demand for SiP (system-in-package) and AiP (antenna-in-package)...

IC substrate suppliers Nan Ya PCB and Kinsus Interconnect Technology both saw their fourth-quarter 2020 revenues hit the year's peak, bolstered by higher prices offered by clients...

Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...

Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration,...

Taiwan-based acoustic solutions specialist Merry Electronics, now in the supply chain for Apple's AirPods, is gearing up to deepen its deployments also in the non-Apple TWS (true...

Taiwan's IC substrate makers Unmicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology have seen their production lines in China running at full capacity to serve Chinese...

Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...

Backend house ShunSin Technology, a subsidiary of Foxconn Technology, is set to start commercial production at its new plants in Vietnam 2021, mainly to fulfill orders from US clients,...

ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...

Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...

IC substrate maker Kinsus Interconnect Technology is set to see its revenues peak for 2020 in the fourth quarter, buoyed by shipments for new iPhones, according to market sources.

A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...

Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...

The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to...

Apple reportedly will have its next-generation AirPods series all adopt system-in-package (SiP) technology, which will significantly boost overall quartz component demand for the...

Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...

IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology have reported impressive revenue increases for the third quarter of 2020 on strong shipments of diverse substrate...

SiP substrates adopted for processing core processors and peripheral components for new Apple Watch models reportedly will be all supplied by three Taiwanese makers, Unimicron Technology,...

ASE Technology and its EMS subsidiary Universal Scientific Industrial (USI) have reportedly grabbed major system-in-package (SiP) orders for the new Apple Watch Series 6 and Apple...

Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...

TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...

Nan Ya PCB's August revenues rose 7.65% on month and 32.26% on year to a nine-year high of NT$3.636 billion (US$124.09 million) and expects its third-quarter revenues to reach the...

System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.

PCB and IC substrate suppliers have seen their shipments for TWS earbuds pick up significantly since the start of second-half 2020, and expect the shipment pull-in momentum to last...

Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...