Lockdowns underway in China to control the spread of COVID-19 are raising the specter of significant disruptions in the global supply chain for electronic components and consumer...
Taiwan's major leadframe makers including Jih Lin Technology and SDI are joining forces with international IDMs to supply customized power modules to Tesla and other first-tier EV...
Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...
Samsung SDI has been trimming its battery pack manufacturing business in China, having shut down two battery pack subsidiaries there in 2021, according to a Korean media report.
Infinenon Technologies has recently announced plans to invest over EUR 2 billion to build a new fab for wide bandgap (WBG) semiconductors (SiC and GaN) at its manufacturing complex...
Rivian and Samsung SDI's joint plan to build lithium battery factory fell through, according to The Elec. The lithium battery industry, which has been embracing surging demand...
Both third-generation semiconductor silicon carbide (SiC) power components and silicon-based insulated gate bipolar transistors (Si-based IGBT) are being used in electric vehicles...
Applications of third-generation semiconductors including SiC and GaN diodes, MOSFETs and related modules are set to take off in 2022, and Taiwan's semiconductor supply chain players...
Taiwanese IC design houses have gradually expanded their deployments in the segment of wide-bandgap (WBG) semiconductors, but will place R&D focus on peripheral driver ICs rather...
The supply of leadframes for chip packaging has been tight, with the visibility of orders from international IDMs for automotive and industrial applications extended to 2023, according...
Taiwan-based leadframe makers Shuen Der Industry (SDI) and Jih Lin Technology are optimistic about shipments for automotive power components and modules over the next two to three...
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...
Tesla posting record production and sales of over 200,000 EVs in second-quarter 2021 has provided a significant growth engine for the EV and automotive electronics supply chains,...