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Thursday 23 August 2018
Taiwan diode suppliers shift focus to automotive sector
Taiwan-based diode suppliers including Eris Technology, HY Electronic, Lite-On Semiconductor, Panjit International and Taiwan Semiconductor Company (TSC) have all shifted their focus...
Thursday 19 July 2018
ASML sales beat guidance in 2Q18
ASML has reported net sales of EUR2.74 billion (US$3.19 billion) for the second quarter of 2018, which went above its guidance range from EUR2.5 billion to EUR2.6 billion.
Thursday 31 May 2018
Global 2017 smartphone AP market drops while growth resumes in tablet AP sector, says Strategy Analytics
The global smartphone applications processor (AP) market declined 5% on year to US$20.2 billion in 2017, while the tablet AP market grew 3% to US$2 billion, according to Strategy...
Friday 25 May 2018
No product roadmap for micro LED displays yet, says AUO
AU Optronics (AUO) has said that it does not have a specific roadmap as well as a schedule for volume production of micro LED display products currently although it has successfully...
Thursday 24 May 2018
Samsung unveils plan for 3nm process
Samsung Electronics has disclosed its comprehensive process technology roadmap updates down to 3nm at the annual Samsung Foundry Forum in the US.
Friday 9 March 2018
ALi STB chips adopted by Videocon d2h
Set-top box (STB) chipset developer ALi has obtained orders from Videocon d2h, an India-based direct-to-home (DTH) operator, for Videocon d2h's next-generation high-definition (HD)...
Tuesday 14 November 2017
Intel, Micron increase 3D XPoint manufacturing capacity with IM Flash fab expansion
Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...
Monday 2 October 2017
Staying focused on profitability: Q&A with UMC co-president SC Chien
United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...
Thursday 14 September 2017
SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing
With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
Tuesday 12 September 2017
Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule
Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...
Thursday 3 August 2017
Commentary: Can Samsung Foundry unseat TSMC?
Samsung Foundry has unveiled an aggressive sub-10nm roadmap that scales down to 4nm, and claimed it is looking to unseat United Microelectronics (UMC) as the world's second-largest...
Thursday 22 June 2017
Faraday MFP ASIC shipments rise at CAGR of 38%
Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...
Wednesday 14 June 2017
Globalfoundries launches 7LP FinFET process
Globalfoundries has announced the availability of its 7nm leading-performance (7LP) FinFET semiconductor technology, delivering a 40% generational performance boost to meet the needs...
Wednesday 14 June 2017
Global 2016 handset baseband market increases 5%, says Strategy Analytics
The global handset baseband processor market grew 5% on year to reach US$22.3 billion in 2016, according to Strategy Analytics. Qualcomm, MediaTek, Samsung LSI, Spreadtrum and HiSilicon...
Tuesday 7 July 2015
Intel said to postpone Kaby Lake processor launch to late 2016
Following the delay of Skylake processors, Intel's next-generation Kaby Lake processors, which were originally scheduled for early 2016, reportedly will be pushed back until September...