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Wednesday 22 September 2021
mmWave finds potential markets in 5G and Satcom: Q&A with MixComm and SiTune CTOs
MixComm, a provider of millimeter-wave (mmWave) and front-end solutions for 5G and Satcom applications, has recently announced a collaboration with SiTune, an innovator of multiple...
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 17 September 2021
GaN Systems strikes deal with BMW
GaN Systems has announced the signing of a comprehensive capacity agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Thursday 9 September 2021
Arm, Taiwan's ITRI join force to help IC design startups grow
Arm is partnering with Taiwan's Industrial Technology Research Institute (ITRI) to develop an ecosystem platform available for international IC design startups looking to invest in...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Wednesday 25 August 2021
Allxon, Trend Micro partnership aims to strengthen security of edge devices
Allxon, a remote monitoring and management platform, has announced a partnership with information security company Trend Micro. Through this partnership, Allxon will integrate Trend...
Friday 20 August 2021
Intel unveils new chip architectures; expands partnership with TSMC
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...
Tuesday 17 August 2021
Arm-based notebook processor shipments post 5-fold jump in 2020
Arm-based notebook computing chips jumped nine-fold in revenue terms and five-fold in unit terms in 2020, according to Strategy Analytics.
Wednesday 21 July 2021
Globalfoundries to build new fab in New York
Globalfoundries (GF) has announced expansion plans for its most advanced manufacturing facility in upstate New York over the coming years. These plans include immediate investments...
Monday 12 July 2021
Vietnam partners with ADB to promote digital government
Vietnam's Ministry of Information and Communications signed a memorandum of understanding (MOU) with Asian Development Bank (ADB) at the end of June to form a partnership for the...
Monday 12 July 2021
Foxconn-Byton partnership facing headwinds
An abrupt top management shakeup at China's Byton Auto is casting clouds over a cooperation deal between Foxconn Technology Group and the Chinese EV startup.
Wednesday 30 June 2021
Synopsys, Samsung Foundry extend partnership to 3nm GAA technology
Synopsys' Fusion Design Platform has enabled Samsung Foundry to achieve first-pass silicon success for an advanced, high-performance and multi-subsystem SoC, validating the extended...
Friday 18 June 2021
Yageo to enhance product mix through mergers, partnership
Passive component manufacturer Yageo, which used to have commodity products account for the majority of revenue, has managed to improve its product mix through several mergers made...
Tuesday 8 June 2021
GF, GlobalWafers extend partnership
Globalfoundries has announced that the foundry and silicon wafer supplier GlobalWafers have struck a US$800 million agreement to add 300mm silicon-on-insulator (SOI) wafer manufacturing...