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NEWS TAGGED PACKAGING AND TESTING
Wednesday 11 May 2022
Taiwan III-V IC makers deliver samples for Wi-Fi 7 RF FEM
Taiwan-based gallium arsenide (GaAs) foundries and epi-wafer suppliers have started delivering epi-wafer samples, which are used in power amplifiers (PA) for Wi-Fi 7 radio-frequency...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Tuesday 12 April 2022
Outlook for IC packaging materials good for 2Q22
Recent lockdown policies along with weak domestic consumer electronics demand in China have caused uncertainty within the semiconductor supply chain.
Tuesday 22 March 2022
SSD control IC shortage to persist through 2022
Tight foundry capacities and shortages of ABF substrates continue to cause solid-state drive (SSD) control IC supply constraints, according to sources at backend houses.
Wednesday 26 January 2022
With high revenue in 1Q22, PTI considers deals with Micron, SK Hynix
Backend house Powertech Technology (PTI) expects to post a double-digit on-year revenue surge in the first quarter of 2022 after posting record business results for 2021, and is optimistic...
Friday 14 January 2022
Niching expects IC packaging materials growth momentum to continue in 2022
Niching Industrial, a Taiwan-based distributor of IC packaging materials, is upbeat about demand for its packaging and testing product lines in 2022 as it plans to cut into the third-generation...
Monday 10 January 2022
Importance of Southeast Asia semiconductor industry highlighted by COVID-19
The impact of COVID-19 on the global semiconductor industry has varied by region, as main chip production bases such as Taiwan and South Korea have dealt well with the pandemic. However,...
Friday 29 October 2021
IC backend quotes to stay favorable to OSATs in 2022, says ASE
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
Wednesday 13 October 2021
Tian Zheng enters into semiconductor applications, expects equipment shipments to double in 2022
Tian Zheng International Precision Machinery (TZI), which has a high market share in sorting, packaging and testing equipment for passive components, has seen strong order momentum...
Friday 8 October 2021
PTI to post flat or slight revenue growth in 4Q21
Powertech Technology (PTI) is expected to post flat or slight sequential revenue growth in the fourth quarter of 2021, when the backend house will see demand for logic chips outperform...
Thursday 7 October 2021
Tongfu to raise CNY5.5 billion for capacity expansions
China-based OSAT Tongfu Microelectronics plans to raise up to CNY5.5 billion (US$854 million) to fund its upcoming capacity expansions for a variety of segments, according to industry...
Friday 1 October 2021
DDI packaging and testing to continue to grow in 2022: Q&A with Chipbond CEO Wu Fei-Jain
Since the outbreak of the COVID-19 epidemic, the global electronics supply chain has been bogged down by the effects of the "broken chain," uneven component supply, and frequent price...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Friday 13 August 2021
IC shortage to remain challenging in 2022, says ASE
A shortfall in the supply of ICs will persist and remain a challenge facing businesses in 2022, according to OSAT market leader ASE Technology.