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NEWS TAGGED PACKAGING AND TESTING
Friday 30 July 2021
IC backend sector to see new supply-demand balance in 2023, says ASE Technology
ASE Technology expects the IC backend sector not to reach a new balance between supply and demand until 2023 at the earliest, and it has landed some long-term orders set for fulfillment...
Wednesday 28 July 2021
PTI raises capex outlook for 2021
Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...
Friday 11 June 2021
ASE Technology posts record revenues for May
ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...
Friday 7 May 2021
Longer production lead times to constrain revenue growth at MCU vendors
Taiwan's MCU vendors will see their revenue growth momentum constrained in the short term by extended delivery lead times at foundry and backend houses, although they have abundant...
Tuesday 4 May 2021
OSATs face increasingly tight supply of packaging materials
OSATs have been notified by their Japan-based packaging materials suppliers including Showa Denko about a potential supply shortfall of as much as 50% between May and June, according...
Thursday 29 April 2021
ASE raises capex projection for 2021
Taiwan's leading OSAT firm ASE Technology Holding will raise its capex budget by 10-15% to up to US$2 billion for 2021, from the previous estimation of US$1.7 billion, according to...
Monday 29 March 2021
SPIL to build NT$80 billion plant in central Taiwan
OSAT firm Siliconware Precision Industries (SPIL), wholly owned by ASE Technology, has secured 14.5 hectares of land in the Central Taiwan Science Park in Changhua County, where the...
Friday 26 March 2021
ASE starts optical sensors production for next-generation AirPods
Backend house ASE Technology has kicked off optical sensors production for the next-generation AirPods slated for launch in the third quarter of 2021, according to industry sources...
Tuesday 12 January 2021
Equipment makers eyeing strong demand from Taiwan OSAT firms
As Taiwan's OSAT output value is estimated to hit another record high in 2021, domestic equipment and materials suppliers are poised to embrace robust demand from the sector, according...
Tuesday 22 December 2020
Taiwan OSAT firms see clear order visibility through mid-2021
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
Thursday 17 December 2020
ASE to set up more smart factories in 2021
ASE Group will complete the establishment of its 18th smart factory by the end of this year, with plans to build seven more intelligent plants in 2021, according to company COO Tien...
Tuesday 8 December 2020
Renesas seeking support from Taiwan OSAT for auto components
Japan-based IDM Renesas Electronics has been aggressively seeking support from its backend partners in Taiwan for next year to meet increasing demand for automotive MCUs and power...
Friday 20 November 2020
Pandemic-triggered structural changes: Q&A with ASE Technology COO Tien Wu
ASE Technology has turned optimistic about the IC backend industry prospects for the first half of 2021 with high capacity utilization to linger in diverse processes despite the coronavirus...
Tuesday 22 September 2020
Notebook power IC prices poised to hike on tight foundry capacity
Taiwanese IC designers are likely to raise their quotes for power management ICs and MOSFETs for notebooks, desktop PCs and servers to reflect increased costs resulting from tight...
Wednesday 22 July 2020
PTI to enter FoPLP volume production in early 2022, says chairman
Memory backend specialist Powertech Technology (PTI) is set to move its FoPLP (fan-out panel level package) technology into volume production starting early 2022, according to company...