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NEWS TAGGED PACKAGING
Friday 20 May 2022
Metaverse concepts boost demand for IC packaging equipment, says K&S executive
Along with emerging metaverse concepts, there is growing demand for equipment for package IC and HPC (high-performance computing) chips, as well as bonding mini/microLED chips, according...
Friday 20 May 2022
Smarter Micro approved for Shanghai STAR listing
China RF front-end module startup Smarter Micro has secured approval to launch an initial public offering (IPO) on the science and technology innovation board (STAR) of China's Shanghai...
Friday 20 May 2022
TSMC to move CoWoS-L technology to commercial production in 2 years
TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...
Wednesday 18 May 2022
Everlight expects automotive miniLED BLU shipments to rise in 2H22
LED chipmaker Everlight Electronics expects shipments of its miniLED backlight units (BLU) for automotive displays to rise in the second half of 2022, when its Taiwan production capacity...
Wednesday 18 May 2022
Equipment maker All Ring lands significant orders for advanced packaging
Fab toolmaker All Ring Tech has landed significant orders from chipmakers, such as TSMC and ASE Technology, which have stepped up their advanced packaging capacity expansions, according...
Tuesday 17 May 2022
LED firm Brightek cautious about 2Q22
LED packaging specialist Brightek Optoelectronic has expressed caution about its business prospects for the second quarter, when sales are expected to hit bottom for 2022.
Monday 16 May 2022
The memory industry (6): When line between memory and logic IC becomes blurred
In 1984, Intel decided to exit the DRAM business, which marked the start of technology diversion between memories and logic IC. In hindsight, Intel's decision made sense. Memories...
Friday 13 May 2022
The memory industy (5): Looking for a new biz model that can create new value
When the memory industry can no longer leverage Moore's Law to create new value, it has to find new technologies to establish a new business model that can create new economic valu...
Wednesday 11 May 2022
MOSFET maker Force-MOS posts record April revenue
Taiwan's MOSFET supplier Force-MOS Technology saw its April revenue hit a record high for the fourth consecutive month, as tight supply of MOSFET chips remains despite a slowdown...
Wednesday 4 May 2022
Intel mulls adopting TSMC 5nm process in new Meteor Lake chips
Intel is evaluating a revision to its blueprints for the 14th Gen Core "Meteor Lake" CPUs by turning to TSMC's 5nm process family to manufacture all of the integrated chips, according...
Tuesday 26 April 2022
ASE competing with leading foundries, IDMs in advanced packaging segment
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Monday 25 April 2022
Demand for HPC chip analysis, inspection stays strong
Demand for HPC chip analysis and inspection remains robust in the second quarter of 2022, according to industry sources in Taiwan, where major pure-play foundries and OSATs operate...
Thursday 21 April 2022
Packaging material vendors 'rationing' supplies to IDMs, OSATs
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
Thursday 21 April 2022
ASE to complete Chungli factory site expansion in 3Q24
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Thursday 21 April 2022
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
Apple has become a bellwether in the HPC chip segment by rolling out its high-performance M1 series built using advanced process at its foundry partner, but all other manufacturing...