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NEWS TAGGED NAND FLASH
Wednesday 16 June 2021
IC Insights raises 2021 IC market forecast to 24% growth
IC Insights has raised its IC market growth forecast for 2021 to 24%, compared with its previous estimate of 19% growth.
Tuesday 15 June 2021
Innodisk poised to post record 2Q21 revenue
Specializing in industrial flash storage, memory module maker Innodisk is poised to see its second-quarter revenue hit a record high, according to market sources.
Wednesday 9 June 2021
DRAM contract prices to rise at slower rate in 3Q21
DRAM contract prices will rise by a slower 3-8% rate in the third quarter after registering a 18-23% rally in the second quarter, according to TrendForce.
Thursday 3 June 2021
Micron eyeing bigger share of memory profit pool
Micron Technology, a supplier of DRAM and NAND flash memory, is eyeing a bigger share of its industry's profits.
Friday 28 May 2021
NAND flash prices to rise faster than DRAM in 3Q21
Contract market prices for NAND flash memory are poised to rise faster than those for DRAM chips in the third quarter of 2021, according to industry sources.
Friday 28 May 2021
Phison buys real estate from Tyntek
NAND flash device controller and module supplier Phison Electronics has announced its takeover of a real estate owned by LED chipmaker Tyntek in Hsinchu, northern Taiwan.
Thursday 27 May 2021
Global NAND flash revenue set to grow in 2Q21, says TrendForce
The global NAND flash market was still oversupplied in the first quarter of 2021, when the memory ASPs fell about 5% sequentially, according to TrendForce. However, with the supply...
Wednesday 26 May 2021
Memory module makers cautiously optimistic about demand from Chia
Memory module houses have seen their sales driven by the mounting mining fever for new cryptocurrency Chia in the second quarter of 2021, but are unsure whether it is sustainable,...
Tuesday 25 May 2021
Macronix remains focused on high-density NOR flash
Macronix International has been putting increased focus on sales of its high-density NOR flash products, while stepping up its deployments in the automotive, industrial, and other...
Monday 24 May 2021
Memory contract prices to see double-digit gains in 3Q21
DRAM and NAND flash memory contract prices are set to register double-digit increases in the third quarter of 2021, according to industry sources.
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Monday 17 May 2021
Ingentec to construct new plant for chipmaking specialty gases
Chipmaking specialty gas specialist Ingentec will kick off construction of a new plant for making specialty gases used in semiconductor manufacturing later this year, according to...
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Tuesday 11 May 2021
Phison optimistic about 2Q21
NAND flash device controller and module supplier Phison Electronics has reported better-than-expected profits for the first quarter of 2021, and is optimistic about its operations...
Monday 10 May 2021
Memory price rally boosts ESMT profit in 1Q21
Niche-market memory IC design house Elite Semiconductor Memory Technology (ESMT) saw its net profit climb over 100% on both sequential and on-year bases to NT$645 million (US$23.22...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.