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NEWS TAGGED MOSFET
Wednesday 13 October 2021
Taiwan backend houses gain shifted orders for MOSFETs from Southeast Asia
Taiwan-based backend houses continue to land shifted orders for MOSFET and other power ICs from Southeast Asia, where operations at fabs run by international IDMs are being disrupted...
Friday 8 October 2021
Gigabyte on track to see 2021 revenue top NT$120 billion
Motherboard and graphics card maker Gigabyte Technology is on track to see its revenues top NT$120 billion (US$4.3 billion) in 2021, thanks to robust demand for cryptomining and gaming...
Monday 27 September 2021
China stepping up development of homegrown 3rd-gen semiconductor supply chain
China with its 14th 5-year Plan (2021-2025) will be stepping up the development of the country's homegrown third-generation semiconductor industry supply chain, according to industry...
Monday 13 September 2021
IDMs, Foxconn, BYD deepening deployments in GaN, SiC devices
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
Friday 10 September 2021
Foxconn to make SiC components at 6-inch fab for EV, solar apps
Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Tuesday 7 September 2021
IDMs migrate to 8-inch wafer fabrication for 3rd-gen semiconductors
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Monday 6 September 2021
Taiwan firms continue to hike car-use MOSFET wafer thinning quotes
Taiwan's wafer thinning specialists including Phoenix Silicon International (PSI), Chipbond Technology and Integrated Service Technology (iST) have seen clear order visibility through...
Wednesday 1 September 2021
Six-inch foundries see promising demand for power MOSFETs, diodes
Taiwan-based six-inch foundries including Advanced Microelectronic Products (AMPI), Episil Technologies, Mosel Vitelic and Nuvoton Technology have given supply priority to automotive,...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Tuesday 17 August 2021
Taiwan MOSFET suppliers seek foundry support for increasing orders
Taiwan-based MOSFET chip suppliers including Advanced Power Electronics, Excelliance MOS, Niko Semiconductor and Sinopower Semiconductor have approached their foundry partners recently...
Tuesday 10 August 2021
MOSFET backend houses to sustain full capacity throughout 2H21
MOSFET backend houses, such as GEM Services, will sustain full capacity utilization throughout the second half of the year in response to strong power devices demand for automotive,...
Monday 9 August 2021
SiC, GaN devices to see production costs fall in next 5 years, says Infineon
Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...
Friday 6 August 2021
OSATs, power chips makers gain shifted orders from ASEAN
Shortages of automotive MOSFET and power management ICs are getting worse as many IDMs including Infinenon and On-Semi are operating at reduced capacity at their plants in Malaysia,...
Friday 6 August 2021
Foxconn gears up for automotive power IC boom
Foxconn (Hon Hai) Technology Group, through its NT$2.52 billion (US$90.67 million) acquisition of Macronix International's 6-inch wafer fab and equipment, will be able to meet a market...
Tuesday 3 August 2021
Standard IC supply to stay tight in short term
The supply of standard ICs including LCD driver ICs, MOSFET chips, 4- and 8-bit MCUs, and specialty DRAM chips will remain tight in the short term, as foundries give their supply...