TSMC's new 5nm Plus node reportedly will be able to enter mass production in the fourth quarter of 2020 with the process...

Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...

IC substrate supplier Kinsus Interconnect Technology swung to net profits of NT$79 million (US$2.6 million) in the first quarter 2020 on revenues of NT$5.89 billion, from losses a...

Robust demand for ABF substrates has significantly driven up first-quarter 2020 revenues at Nan Ya PCB and Kinsus Interconnect, with the growth momentum expected to last through at...

Kinsus Interconnect Technology, after returning to profitability in fourth-quarter 2019, is expected to gain further profit momentum for the whole of 2020 by focusing on ABF substrates,...

The fourth quarter of 2019 was a traditional slow season for the small- to medium-size panel industry, but Taiwan's shipments still grew 16.6% sequentially in the quarter thanks to...

Taiwan-based Universal Scientific Industrial (USI), a unit of ASE Technology, is likely to obtain system-in-package (SiP) orders for AirPods Pro Lite, which may also benefit Taiwanese...

Apple's demand for 5nm A14 mobile application processors (AP) to support its 5G devices is likely to be 50-60% higher than that for its 7nm A13, highlighting the vendor's determination...

Taiwan-based IC substrate makers Unimcron, Na Ya PCB and Kinsus Interconnect Technology are actively proceeding with capacity expansions for ABF substrates in 2020 to meet robust...

Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...

IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...

Taiwan IC substrate makers will have no time to lose in expanding their ABF substrate capacities as demand for such substrates will grow substantially in 2020 and beyond along with...

As US leading chipmakers and system vendors are gearing up to commercialize their mmWave technologies, TSMC reportedly has landed a big order from Apple for processing handset antenna...

Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...

Taiwanese PCB maker Zhen Ding Technology (ZDT) and Austrian peer AT&S are expected to together land at least 50-60% of substrate-like PCB orders for Apple's next iPhones to be...

Global shipments of TWS (true wireless stereo) earphones are expected to surge sharply to 150-200 million sets in 2020 from around 100 million sets estimated for 2019, providing strong...

Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt...

ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...

IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...

Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...

Flexible PCB manufacturer Fuyang Technology, a joint venture between Pegatron and Kinsus Interconnect Technology, has reportedly entered the supply chain of Apple.

Among supply chain partners for iPhones, Taiwan's PCB makers have suffered significantly from the devices' latest wave of lackluster sales, with flexible board suppliers Zhen Ding...

Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...

IC substrate supplier Kinsus Interconnect Technology's net profits fell 78% on year to NT$491 million (US$16.8 million) in 2017. EPS for the year came to NT$1.10, down from NT$5.01...

As GPU suppliers AMD and Nvidia showcase their prowess at CES 2018, back-end service providers, such as Siliconware Precision Industries (SPIL) and King Yuan Electronics, are expected...