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NEWS TAGGED IC
Wednesday 25 May 2022
Global top-3 DRAM makers hold 94% of 2021 market
Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...
Wednesday 25 May 2022
EIH works with Himax to develop e-paper driver IC solution
Electronic paper (e-paper) maker E Ink Holdings (EIH) has cooperated with display image processing IC design house Hiamx Technologies to develop an e-paper-use driver IC solution...
Wednesday 25 May 2022
Bullish custom processor demand to buoy IC test interface specialists
Taiwan-based IC test interface specialists including Chunghwa Precision Test Tech (CHPT) and WinWay Technology are all poised to embrace strong demand for custom accelerator chips...
Monday 23 May 2022
IC designers eyeing demand from emerging AIoT markets
Taiwan-based IC-design houses are eyeing emerging AIoT application markets to help sustain future sales as chip demand from the traditional sectors such as handsets and notebooks...
Monday 23 May 2022
IC industry suppliers see varied prospects
Global semiconductor and IT suppliers have raked in unprecedented revenue growths, thanks to COVID-driven stay-at-home economy. However, the reveling seems to be drawing to an end,...
Monday 23 May 2022
China-based IC production to represent 21% of China IC market in 2026
IC production in China represented 16.7% of its US$186.5 billion IC market in 2021, up from 12.7% 10 years earlier in 2011, according to IC Insights. The share is forecast to increase...
Friday 20 May 2022
Metaverse concepts boost demand for IC packaging equipment, says K&S executive
Along with emerging metaverse concepts, there is growing demand for equipment for package IC and HPC (high-performance computing) chips, as well as bonding mini/microLED chips, according...
Friday 20 May 2022
IC test solutions providers see orders for HPC chips boom
IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors,...
Friday 20 May 2022
IC design houses bracing for cutback in orders from China handset brands
Taiwan-based IC design houses particularly LCD driver IC firms continue to see their China-based handset clients decelerate their pace of orders, bracing for a potential cutback in...
Thursday 19 May 2022
The rise of top 10 IC design companies in China
China, the world's leading consumer of semiconductors, is undergoing a third semiconductor shift in tandem with the development of 5G, consumer electronics, and AI. Owing to the shift...
Thursday 19 May 2022
Macroblock expects 2-digit sales growth in 2Q22
LED driver IC design house Macroblock expects to post a double-digit sequential revenue increase with high gross margin in the second quarter of 2022, driven by robust demand for...
Thursday 19 May 2022
Six-inch fab capacity to stay full utilized through 3Q22
Six-inch IC foundries, such as Mosel Vitelic and Nuvoton Technology, continue to run their fabs at full capacity utilization despite a recent slowdown in orders for LCD driver chips...
Wednesday 18 May 2022
WPG expects revenue, profit drops in 2Q22
IC distributor WPG Holdings expects to post sequential revenue and profit drops in the second quarter of 2022, due to the impact of COVID-induced lockdowns in China on both its supply...
Tuesday 17 May 2022
DDI prices under strengthening downward pressure
LCD display driver IC (DDI) prices, particularly those for handsets, are poised to fall further in the second quarter of 2022, and even handset-use OLED DDI prices are likely to fall...
Tuesday 17 May 2022
Brand notebook vendors cut orders for 2022
Brand notebook vendors have cut back orders with suppliers in 2022, particularly orders for Chromebooks, and have also revised downward annual shipment targets, according to sources...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.