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NEWS TAGGED HUAWEI
Wednesday 20 October 2021
Honor strengthens smartphone marketing in overseas channels
Honor, a spinoff from Huawei, has been re-establishing its partnerships with US-based vendors including Qualcomm, Microsoft and Intel since early 2020 and has risen to third place...
Friday 15 October 2021
Global tablet shipment forecast, 2022 and beyond
Global tablet shipments started to decline due to the component shortage. In 2022, with the component shortage easing, global tablet shipments are projected to increase 1.3% from...
Wednesday 13 October 2021
Global smartphone shipment forecast, 2022 and beyond
With COVID-19 becoming like the seasonal flu and having diminishing influence, Digitimes Research expects smartphone shipments to grow between 4-7% annually over the next five years,...
Friday 8 October 2021
Global notebook shipment forecast, 2022 and beyond
Global notebook shipments are expected to come to 236 million units in 2021, once again setting a new record in history. However, the year-over-year growth will fall short of the...
Thursday 7 October 2021
Global server shipment forecast, 2022 and beyond
Large datacenter demand will remain the main growth driver for server shipments 2021 through 2026. On top of that, 5G white-box telecom datacenter demand will also spur some growth...
Thursday 7 October 2021
Huawei VC arm makes investment in another IC firm
Huawei's venture arm Hubble Technologies has made investments in a number of China-based IC companies, including its latest investment in Chongqing Wuqi Tech, which develops AIoT...
Monday 4 October 2021
PCB suppliers see normal order momentum for iPhone 13 series
Apple reportedly is cutting component orders for iPhones by up to 25%, but Taiwan's PCB makers in the supply chain for the new iPhone 13 have stressed their order momentum from the...
Wednesday 22 September 2021
YMTC ready to volume produce 128-layer QLC NAND flash
China-based Yangtz Memory Technologies (YMTC) has shipped over 300 million 64-layer 3D NAND flash memory chips and is ready to volume produce 128-layer QLC (quad-level cell) NAND,...
Wednesday 22 September 2021
MediaTek releases Kompanio 900T AP for tablets
MediaTek has recently launched the Kompanio 900T AP for Android-based tablets and expects the chip to help it maintain the leadership in the Android tablet AP market.
Friday 17 September 2021
China stepping up deployments in homegrown car-use SiC modules
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Wednesday 1 September 2021
Downward pressure on pricing drives momentum in wearables, says IDC
Global wearables shipments grew 32.3% on year as volumes reached 114.2 million during the second quarter of 2021, according to IDC.
Tuesday 31 August 2021
Honor becomes 3rd-largest handset brand in China
Honor sold four million handsets in China in July, becoming China's third-largest handset brand, according to CINNO Research.
Friday 20 August 2021
Global tablet market – 2Q 2021
Global tablet shipments reached 34.69 million units in the second quarter of 2021, down 3.5% sequentially and 12.5% on year.
Thursday 19 August 2021
Taiwan large-size LCD panels – 2Q 2021
Taiwan's large-size LCD panel shipments reached 71.93 million units in the second quarter of 2021, down 0.4% sequentially, but up 11.7% on year.
Wednesday 18 August 2021
China smartphone AP shipments – 2Q 2021
Second-quarter 2021 smartphone application processor (AP) shipments to China-based vendors amounted to 218 million units, up 3% quarter-over-quarter.
Monday 4 September 2017
IFA 2017: Huawei Kirin 970
Huawei has launched the Kirin 970 at IFA 2017 in Berlin, a chip that combines the power of the cloud with the speed and responsiveness of native AI processing, according to the company. Cloud AI has seen broad application, but user experience still has room for improvement, including latency, stability, and privacy, according to the vendor. Cloud AI and on-device AI can complement each other. On-device AI offers strong sensing capabilities, which are the foundation of understanding and assisting people. Sensors produce a large amount of real-time, scenario-specific, and personalized data. Supported by strong chip processing capabilities, devices will become more cognitive of user needs, providing personalized and readily accessible services. Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU. Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one square centimeter. Huawei's new flagship Kirin 970 is its first mobile AI computing platform featuring a dedicated neural processing unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970's new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. The Kirin 970 can perform the same AI computing tasks faster and with far less power, Huawei claims. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, which was faster than other chips on the market. Huawei is positioning the Kirin 970 as an open platform for mobile AI, opening up the chipset to developers and partners.