Taiwan's IC substrate suppliers will continue to enjoy robust shipments of BT-based FCCSP substrates for handset SoCs throughout first-quarter 2021, but may see off-season impacts...

Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and WinWay Technology have both obtained major orders for MediaTek's new-generation 5G SoC chips slated...

HDI PCB manufacturers have seen a significant ramp-up in orders from Oppo, Vivo and Xiaomi, who are seeking sufficient supply of components to support their expansion in the China...

Chinese handset vendors Oppo, Vivo and Xiaomi (OVX) have stepped up their purchases of ICs and basic components for their smartphones as part of their efforts to expand presence in...

MediaTek continues to enhance its ASIC and IP design capability through several acquisitions announced recently, while recruiting talent from the IP and IC design industry sectors,...

China-based handset vendor Oppo has launched its 5G-enable Reno 5 series products in the Taiwan market with the availability to begin on January 16.

Taiwan's flexible PCB makers in the supply chain of Apple devices have posted hefty on-month revenue gains for December 2020 thanks to strong shipments supporting hot sales of iPhone...

IC substrate suppliers Nan Ya PCB and Kinsus Interconnect Technology both saw their fourth-quarter 2020 revenues hit the year's peak, bolstered by higher prices offered by clients...

Taiwan's major HDI board makers have seen strong shipment pull-ins from Chinese handset vendors since fourth-quarter 2020, with the momentum expected to persist through at least the...

Unfavorable macro conditions, including the US-China trade war and COVID-19, have been slowing down 5G deployments across the globe, but 5G will still play a crucial role in driving...

IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...

Android-camp handset vendors including Samsung Electronics are expected to follow in the footsteps of Apple in incorporating direct time-of-flight (dToF) CMOS image sensors (CIS)...

Chip demand from China's white-box handset charger market will be rising robustly in 2021, according to industry sources.

Global large-size LCD panel shipments will fall at a CAGR of -0.3% 2020 through 2025, while shipments of small-to-medium-size panels will be at 0.14%.

The output value of Vietnam's handset and related component industry came to US$46.9 billion in the first 11 months of 2020, accounting for 18.4% of the country's total export value...

Unimicron Technology expects to resume shipments of BT-based FCCSP substrates for processing handset SoCs in first-quarter 2021 at the earliest, with the shipments to be delivered...

Prosperity Dielectrics Company (PDC) has stepped up the development of glass-ceramic powder materials for low temperature co-fired ceramic (LTCC) components for use in RF front-end...

Passive component maker Walsin Technology has disclosed plans to expand production capacity for LTCC filters and automotive MLCCs next year at its manufacturing facilities in Kaohsiung,...

Taiwan's IC substrate makers Unimicron Technology and Kinsus Interconnect are poised to benefit significantly from 5G handset sales boom expected in 2021 as they reportedly have secured...

IC substrate maker Kinsus Interconnect Technology has reported November revenue climbed 24.7% on year to a record high of NT$2.56 billion (US$90.7 million), and is expected to see...

Sony has recently estimated its CMOS image sensor (CIS) sales for fiscal 2020 (April 2020-March 2021) to fall 11.8% on year compared to a 6.5% decline estimated earlier, due mainly...

Ahead of the new US trade sanctions against Huawei taking effect on September 15, Hannstar had geared up its handset panel shipments to the Chinese vendor, which helped boost Taiwan's...

Sales of the iPhone 12 Pro have been higher than expected in the Taiwan market since its launch, with the current supplies of the model lagging demand by 40%, and it will take about...

IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...

Some handset brands are mulling using plastic back covers for their 5G-enabled entry-level phones to boost shipments, according to industry sources.