2047 news items tagged handset
BT substrate shipments for 5G handset SoCs may slow down in 2Q21
Monday 25 January 2021Taiwan's IC substrate suppliers will continue to enjoy robust shipments of BT-based FCCSP substrates for handset SoCs throughout first-quarter 2021, but may see off-season impacts...
CHPT, WinWay land major test interface orders for 5G handset SoCs
Wednesday 20 January 2021Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and WinWay Technology have both obtained major orders for MediaTek's new-generation 5G SoC chips slated...
HDI PCB makers see ramp-up in orders from China handset vendors
Thursday 14 January 2021HDI PCB manufacturers have seen a significant ramp-up in orders from Oppo, Vivo and Xiaomi, who are seeking sufficient supply of components to support their expansion in the China...
China smartphone vendors step up chips, components procurement
Thursday 14 January 2021Chinese handset vendors Oppo, Vivo and Xiaomi (OVX) have stepped up their purchases of ICs and basic components for their smartphones as part of their efforts to expand presence in...
MediaTek enhances ASIC and IP design capability
Thursday 14 January 2021MediaTek continues to enhance its ASIC and IP design capability through several acquisitions announced recently, while recruiting talent from the IP and IC design industry sectors,...
Oppo launches Reno 5 in Taiwan, as shipments not affected by component shortages
Wednesday 13 January 2021China-based handset vendor Oppo has launched its 5G-enable Reno 5 series products in the Taiwan market with the availability to begin on January 16.
Taiwan flexible PCB makers log big revenue gains in December
Friday 8 January 2021Taiwan's flexible PCB makers in the supply chain of Apple devices have posted hefty on-month revenue gains for December 2020 thanks to strong shipments supporting hot sales of iPhone...
Nan Ya, Kinsus see 4Q20 revenues peak on strong IC substrate demand
Friday 8 January 2021IC substrate suppliers Nan Ya PCB and Kinsus Interconnect Technology both saw their fourth-quarter 2020 revenues hit the year's peak, bolstered by higher prices offered by clients...
HDI PCB makers see strong shipments to Chinese handset vendors
Thursday 7 January 2021Taiwan's major HDI board makers have seen strong shipment pull-ins from Chinese handset vendors since fourth-quarter 2020, with the momentum expected to persist through at least the...
5G to fuel semiconductor demand
Wednesday 6 January 2021Unfavorable macro conditions, including the US-China trade war and COVID-19, have been slowing down 5G deployments across the globe, but 5G will still play a crucial role in driving...
Backend house Winstek to enjoy 10% sales growth in 2021
Tuesday 5 January 2021IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...
Taiwan III-V suppliers to increase VCSEL shipments for dToF sensors for Android phones
Monday 4 January 2021Android-camp handset vendors including Samsung Electronics are expected to follow in the footsteps of Apple in incorporating direct time-of-flight (dToF) CMOS image sensors (CIS)...
Chip demand for white-box handset chargers to grow robustly
Monday 4 January 2021Chip demand from China's white-box handset charger market will be rising robustly in 2021, according to industry sources.
Global LCD panel shipment forecast, 2021 and beyond
Tuesday 29 December 2020Global large-size LCD panel shipments will fall at a CAGR of -0.3% 2020 through 2025, while shipments of small-to-medium-size panels will be at 0.14%.
Vietnam handsets and related components output value totals US$46.9 billion
Tuesday 22 December 2020The output value of Vietnam's handset and related component industry came to US$46.9 billion in the first 11 months of 2020, accounting for 18.4% of the country's total export value...
Unimicron may resume fire-disrupted shipments of FCCSP substrates in 1Q21
Thursday 17 December 2020Unimicron Technology expects to resume shipments of BT-based FCCSP substrates for processing handset SoCs in first-quarter 2021 at the earliest, with the shipments to be delivered...
Prosperity Dielectrics steps up development for LTCC powder
Wednesday 16 December 2020Prosperity Dielectrics Company (PDC) has stepped up the development of glass-ceramic powder materials for low temperature co-fired ceramic (LTCC) components for use in RF front-end...
Walsin to boost LTCC filter, automotive MLCC capacity in 2021
Thursday 10 December 2020Passive component maker Walsin Technology has disclosed plans to expand production capacity for LTCC filters and automotive MLCCs next year at its manufacturing facilities in Kaohsiung,...
Unimicron, Kinsus to embrace 5G handset sales boom in 2021
Wednesday 9 December 2020Taiwan's IC substrate makers Unimicron Technology and Kinsus Interconnect are poised to benefit significantly from 5G handset sales boom expected in 2021 as they reportedly have secured...
Kinsus 4Q20 revenues to peak on strong shipments for handset applications
Tuesday 8 December 2020IC substrate maker Kinsus Interconnect Technology has reported November revenue climbed 24.7% on year to a record high of NT$2.56 billion (US$90.7 million), and is expected to see...
Sony estimates CIS sales for fiscal 2020 to fall 11.8% on weak handset demand
Tuesday 1 December 2020Sony has recently estimated its CMOS image sensor (CIS) sales for fiscal 2020 (April 2020-March 2021) to fall 11.8% on year compared to a 6.5% decline estimated earlier, due mainly...
Taiwan small- to mid-size LCD panels – 3Q 2020
Monday 30 November 2020Ahead of the new US trade sanctions against Huawei taking effect on September 15, Hannstar had geared up its handset panel shipments to the Chinese vendor, which helped boost Taiwan's...
Supply of iPhone 12 Pro tight in Taiwan
Friday 27 November 2020Sales of the iPhone 12 Pro have been higher than expected in the Taiwan market since its launch, with the current supplies of the model lagging demand by 40%, and it will take about...
ASE, Greatek see QFN wire bonding run at full capacity for PMICs
Friday 27 November 2020IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...
Plastic handset cases may stage a comeback on entry-level 5G phones
Monday 23 November 2020Some handset brands are mulling using plastic back covers for their 5G-enabled entry-level phones to boost shipments, according to industry sources.
- Smelling blood, Huawei's Chinese mobile rivals look to capitalise on its U.S. woes (Nov 23) - Yahoo! Asia News
- Exclusive: Huawei to sell phone unit for $15 billion to Shenzhen government, Digital China, others - sources (Nov 10) - Reuters
- Qualcomm angles to get a piece of the $8 billion market for 5G infrastructure (Oct 20) - CNBC