With PCB and IC substrate suppliers looking to expand capacity, related equipment suppliers will be busy fulfilling orders that will be ramping up substantially through 2022, according...
Taiwan-based Symtek Automation Asia (SAA), which provides automated equipment to support capacity expansions at PCB and IC substrate makers, has seen the visibility of customer orders...
Tian Zheng International Precision Machinery (TZI), which has a high market share in sorting, packaging and testing equipment for passive components, has seen strong order momentum...
Taiwan-based metal chassis maker Catcher Technology is reportedly in talks with Malaysia-based medical equipment suppliers for cooperation, and may choose Malaysia as its regional...
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Huawei's venture arm Hubble Technologies has made investments in a number of China-based IC companies, including its latest investment in Chongqing Wuqi Tech, which develops AIoT...
TSMC is poised to comprehensively expand production capacities for both its 7nm and 28nm process technologies, in addition to its planned 5nm process expansion, which may prompt the...
TSMC is expected to kick off equipment move-in at its new advanced packaging fab in Chunan, northern Taiwan later in the second half of this year, according to a report by Taiwan's...
Supply of copper foils has been constrained due to longer delivery times for crucial production equipment, while copper foil suppliers continue to encounter rising costs, according...
August billings among North American manufacturers of semiconductor production equipment decreased 5.4%, bringing an end to an eight-month period of consecutive increases.
Mirle Automation, dedicated to supplying automated logistics systems and flat panel display (FPD) transporting equipment, has seen its backlog of orders exceed NT$10 billion (US$360.6...
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly US$100 billion...
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide)...
