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NEWS TAGGED DISPLAY
Friday 3 December 2021
AUO Display Plus showcasing smart medical care solutions at Healthcare Expo Taiwan 2021
AUO Display Plus, a subsidiary of AUO specializing in commercial and industrial display solutions, is showcasing eight smart medical care solutions applied to surgical operation theaters,...
Thursday 2 December 2021
DDI backend firms see demand for large-size panels pick up
Display driver IC (DDI) backend specialists including ChipMOS Technologies and Chipbond Technology have seen demand for large-size panels pick up since the fourth quarter of 2021,...
Wednesday 1 December 2021
Arlitech positive about panel-use inductor shipments in 1H22
Taiwan-based inductor maker Arlitech Electronic maintains a positive outlook for its shipments for LCD display applications in the first half of 2022, when brand vendors of TV and...
Wednesday 1 December 2021
Samsung intros new logic solutions to power next-gen automobiles
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
Thursday 25 November 2021
OLED DDI supply may fall short of demand in 2022
OLED display driver ICs (DDI) supply may fall short of demand in 2022, with the chip shortage likely to disrupt shipments for smartphones, according to industry sources.
Thursday 25 November 2021
Audio IC shortage easing
Notebook-use audio IC shortages are easing, with the supply shortfall expected to narrow next year, according to industry sources.
Wednesday 24 November 2021
Samsung Display to expand OLED panel capacity
Samsung Display (SDC) is poised to expand production capacity for TV-use QD-OLED panels or IT-use OLED panels in South Korea, according to local media.
Wednesday 24 November 2021
Space4M, PanelSemi co-develop drone e-sports race track solution based on flexible miniLED display
Smart retail solution provider Space4M, a subsidiary of AU Optronics (AUO), and miniLED solution provider PanelSemi, a subsidiary of Innolux, have jointly developed a solution of...
Wednesday 24 November 2021
TV IC demand to pick up as early as 1Q22
TV-related IC demand is expected to pick up as early as the first quarter of 2022 following a slowdown in TV market sales seen since the third quarter of 2021, according to sources...
Tuesday 23 November 2021
New MediaTek TV SoC built using TSMC 7nm process
MediaTek has unveiled its new Pentonic smart TV SoC family with the introduction of the 2000 series, which will power next generation flagship 8K TVs. The new SoC series is the world's...
Friday 19 November 2021
Taiwan COF packaging/testing service providers positive about 4Q21 demand
Taiwan-based COF (chip on film) OSAT (outsourced semiconductor assembly and test) service providers such as ChipMOS Technologies and Chipband Technology as well as COF substrate supplier...
Thursday 18 November 2021
Niching cuts into China 3rd-gen semiconductor supply chain
Niching Industrial with its in-house developed low-temperature sintering Ag paste materials has cut into China's third-generation semiconductor industry supply chain, according to...
Tuesday 16 November 2021
Novatek to expand IC design talent pool
Taiwan-based display driver IC vendor Novatek Microelectronics plans to hire an additional 400-500 design engineers in 2022 while also increasing pay to expand its talent pool.
Tuesday 16 November 2021
Taiwan IC design houses see gross margins come under downward pressure
With pure-play foundries initiating another price hikes to reflect their continued tight fab capacities, many Taiwan-based IC design houses are finding it increasingly difficult to...
Monday 15 November 2021
Taiwan small- to mid-size LCD panels - 3Q 2021
Taiwan's small- to medium-size panel shipments are expected to increase 10.9% sequentially in the third quarter of 2021 due to seasonality.
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.