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Monday 26 July 2021
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
Monday 26 July 2021
UMC to raise quotes for 40nm, other processes in 1Q22
United Microelectronics (UMC) plans to raise its foundry quotes for 40nm process technology by 10-15% starting the first quarter of 2022, as well as quotes for other mature process...
Tuesday 20 July 2021
Chip orders for 5G smartphones picking up
Most Taiwan-based IC design houses are poised to see their revenues grow at least 10% sequentially in the third quarter of 2021, bolstered by a pick-up in chip orders for 5G smartphones,...
Thursday 15 July 2021
Mature-node fab capacity to stay tight through 2022
Foundries continue to run their mature-node fabs at full capacity utilization, which will likely persist through 2022, according to sources at Taiwan-based IC design houses.
Wednesday 14 July 2021
Intel seeks to regain advanced manufacturing lead
Intel is eyeing to regain its manufacturing lead, particularly advanced process manufacturing. Intel's capex for 2021 will be a nearly 10-year high for the company, despite being...
Tuesday 13 July 2021
DDR3 prices to continue rally
The supply of DDR3 memory will stay tight prompting further price increases through the end of 2021, according to industry sources.
Monday 28 June 2021
Taiwan IC design houses to hike prices in 2H21
Taiwan-based IC design houses have notified their customers about price hikes in the second half of 2021 to reflect rising manufacturing costs, according to industry sources.
Friday 25 June 2021
Notebook ODMs see chip supply improve
Improving chip supply will allow notebook ODMs to fulfill more of their orders in hand in the third quarter of 2021, according to industry sources.
Thursday 24 June 2021
KLA launches new portfolio of automotive products
KLA has announced the launch of four new products for automotive chip manufacturing: the 8935 high productivity patterned wafer inspection system, the C205 broadband plasma patterned...
Wednesday 23 June 2021
Taiwan IC design houses remain upbeat about 3Q21
Taiwan-based IC design houses remain upbeat about their sales growth in the third quarter of 2021, despite a recent cutback in orders from the notebook sector, according to industry...
Tuesday 22 June 2021
Handset chipmakers see improving order visibility for 3Q21
Taiwan-based chipmakers have seen their order visibility for handset-use LCD driver ICs and fast-charging solutions become clear for third-quarter 2021, thanks to robust handset sales...
Friday 18 June 2021
Foundries to initiate another price increases
Taiwan-based IC design houses, including first-tier players and those specializing in LCD driver ICs and MOSFET chips, have been notified by their foundry partners about another price...
Thursday 17 June 2021
Ansys multiphysics solutions achieve certification for TSMC N3 and N4
Ansys has achieved certification of its cutting-edge multiphysics signoff solutions for TSMC's advanced N3 and N4 process technologies, according to the EDA company. This enables...
Wednesday 16 June 2021
Macroblock to kick off volume shipments for miniLED-backlight solutions in 2H21
LED driver IC design-house Macroblock will start ramping up its shipments of miniLED-backlight solutions in the second half of 2021, targeting notebook and large-size TV applicatio...
Wednesday 16 June 2021
Taiwan IC design houses upbeat about shipments for 5G phones
Taiwan-based IC design houses are optimistic about their shipments for smartphone applications in the third quarter of 2021, thanks to the upcoming rollouts of new 5G-enabled models,...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.