Nan Ya Printed Circuit Board has disclosed plans to invest a total of NT$8 billion (US$286.4 million) to expand production capacity for ABF substrates at its factory site in Shulin,...

Intel has launched its new Core H series mobile processors (Tiger Lake-H) led by the Core i9-11980HK, targeting the gaming, Creator and enterprise notebook markets.

Sales of PC peripherals, CPUs and motherboards are expected to be impacted by second-hand mint products offloaded by cryptominers in the second half of 2021, according to sources...

Global notebook shipments not including devices with detachable keyboards went down only 8.7% sequentially in the first quarter of 2021 as demand for education and gaming models remained...

Suppliers including foundry TSMC are expected to kick off production for the redesign of Sony's PlayStation 5 (PS5) games console between the second and third quarters of 2022, according...

First-quarter 2021 global server shipments amounted to 3.78 million units, down only 1.6% quarter-over-quarter and up 5.2% year-over-year.

White-box server ODMs such as Quanta Computer and Wiwynn saw their shipments to datacenter operators account for more than 38% of the global total server shipments in 2020, up 8pp...

Major Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are negotiating with AMD a new form of supply deals under which the suppliers...

Shipments for SoC chips adopting Andes Technology's processor IPs topped two billion units in 2020, up 33% on year and hitting a record high, according to Frankwell Lin, CEO for the...

ODMs including Quanta Computer and Wiwynn will see their shipments for servers register double-digit sequential increases in the second quarter of 2021, according to industry sourc...

Intel with its new-generation 10nm server chips will be striving to defend its market dominance.

Apple has introduced a new iMac in a 11.5mm-thin design, enabled by the M1 chip. It also unveiled a new Apple TV 4K powered by the A12 Bionic chip.

Demand for flip-chip (FC) packaging particularly FC-BGA will be rising significantly driven by the HPC device market boom this year, and backend houses in Taiwan and China have seen...

Nvidia CEO Jensen Huang has unveiled the company's latest innovations covering autonomous machines, AIs, chips, supercomputers and software during his presentation at GTC 2021.

TSMC's bold US$100 billion capex plan for the next three years has greatly boosted the confidence of its ecosystem partners about bright prospects for the semiconductor industry,...

Server components including ICs, passive components, cables and chassis have seen supply growing tighter in the second quarter, according to sources from the server supply chain.

Testing houses including Sigurd Microelectronics and King Yuan Electronics have already seen their capacity fall short of demand since the start of the second quarter, driven by strong...

Taiwan-based Powertech Technology (PTI), a packaging partner for Intel's NAND flash chips, has newly landed backend SMT testing orders for CPUs from the chipmaker, and will see the...

Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.

IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...

Taiwan-based server chassis maker Chenbro Micom expects demand for datacenters from the US and China to begin rising in April as new server CPU platforms will launch and clients'...

Taiwan's IC substrate makers with their strong technological prowess are in pole position to explore business opportunities from China's ongoing homegrown CPU development campaign,...

Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...

Nan Ya PCB has disclosed plans to spend at least NT$8 billion (US$287.5 million) in 2021, compared to a capex of NT$7.35 billion for 2020, for capacity expansions at its plants in...

With its advantages in edge computing and mobile device applications, Arm has been expanding its server solution offerings, heading towards high performance computing instead of staying...