With Apple reportedly looking to incorporate mini LED display technology into its iPad and MacBook product lines between second-half 2020 and first-half 2021, Taiwan-based flexible...

Taiwan's COF (chip on film) supply chain is poised to embrace a prosperous year in 2020, as new COF solutions are expected to be massively applied to integrate optical in-display...

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

Taiwan-based backend houses including KYEC and Chipbond expect to see stable growth in demand for baseband chips and LCD driver ICs for Apple iPhone.

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may...

As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...

Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...

LCD driver IC backend specialist Chipbond Technology has reported net profit surged 76.2% from a year earlier to NT$1.98 billion (US$63.2 million) in the first half of 2019. EPS for...

Prices of TDDI (touch with display driver integration) chips are under continued downward pressure, as competition in the sector is heating up due to capacity ramps by related IC...

Taiwan-based backend houses and COF substrate suppliers will see orders from Huawei pick up in July or August, according to industry sources.

Chip-on-film (COF) substrate suppliers JMC Electronics saw its revenues for June and the second quarter of 2019 hit record-high levels.

Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...

Chip-on-film (COF) substrate suppliers JMC Electronics is expected to see its revenue and profit climb to record-high levels in the second quarter of 2019, driven mainly by a rally...

Zhen Ding Technology and Flexium Interconnect, both of which are reportedly among the flexible PCB suppliers of Apple, see low order visibility, according to industry sources.

Taiwan makers of flexible PCBs are gearing up to develop niche board products for mini LED and COF (chip on film) applications, which are expected to become their new growth drivers...

Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...

Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...

Chip-on-film (COF) substrate suppliers JMC Electronics expects to post flat growth or a slight decrease sequentially in third-quarter revenues, due to a cutback in orders in the wake...

Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...

COF packaging demand for automotive OLED displays has emerged, which may further tighten market supply as capacity expansion will remain quite limited in the short term, according...

With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...

Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...

Zhen Ding Technology is expected to begin shipments of its rigid-flex PCBs for automotive camera modules later in 2019, according to industry sources. The PCB manufacturer will start...

Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk...

Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...