TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...
Taiwan-based optical inspection equipment (AOI) supplier Utechzone expects to post impressive revenue growth this year, driven by robust demand from chipmaking and IC substrate clients...
Taiwan-based COF (chip on film) OSAT (outsourced semiconductor assembly and test) service providers such as ChipMOS Technologies and Chipband Technology as well as COF substrate supplier...
Niching Industrial with its in-house developed low-temperature sintering Ag paste materials has cut into China's third-generation semiconductor industry supply chain, according to...
Semiconductor materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all set to see their fourth-quarter revenues stay high despite uncertainty...
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Chang Wah Electomaterials (CWE), after building a solid presence in the distribution of semiconductor materials, is on track to transform into a manufacturer of diverse materials...
Taiwan's semiconductor materials distributors including Topco Scientific, Wah Lee Industrial, Topco Technologies, and Chang Wah Electromaterials are all upbeat about their sales in...
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Semiconductor material distributors including Topco Scientific, Topco Technologies and Wahlee Industrial, and IC packaging materials distributors Chang Wah Electromaterials (CWE)...
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
