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NEWS TAGGED CHIPMOS
Tuesday 4 May 2021
OSATs face increasingly tight supply of packaging materials
OSATs have been notified by their Japan-based packaging materials suppliers including Showa Denko about a potential supply shortfall of as much as 50% between May and June, according...
Thursday 22 April 2021
ChipMOS to expand backend capacity for memory chips
Backend house ChipMOS Technologies will expand production capacity for memory chips by 30-40% in 2021 to meet strong demand from major memory module makers in Taiwan, according to...
Monday 12 April 2021
Backend demand stays strong for MOSFETs, niche DRAMs
Persistently strong demand for MOSFET chips and niche-type DRAM have kept backend specialists including Walton Advanced Engineering, ChipMos Technologies and GEM Services running...
Monday 22 March 2021
IC materials distributors buoyed by strong e-paper DDI demand
Semiconductor materials distributors are expected to gain profit momentum from brisk sales of COG or COF packaging materials driven by robust demand for e-paper and ESL (electronic...
Wednesday 17 March 2021
ChipMOS expects double-digit sales growth in 2021
Taiwan's display driver IC (DDI) backend specialist ChipMOS Technologies expects to post a double-digit revenue growth in 2021 with better profits than 2020, driven by robust DDI...
Friday 12 March 2021
DRAM probe card demand ramping up
Major memory probe card vendors in the US and Japan have seen a surge in demand from DRAM suppliers, with delivery lead times for their orders already extended to around 20 weeks...
Wednesday 10 March 2021
Packaging materials vendors gaining from strong DDI demand
Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...
Wednesday 3 March 2021
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Wednesday 24 February 2021
Taiwan chipmakers moving to counter water shortages
Chipmakers including TSMC and UMC have started buying water by the truckload for their foundries in Southern Taiwan Science Park (STSP), as reservoirs in southern Taiwan face dwindling...
Wednesday 17 February 2021
Backend houses to thrive on strong demand for 5G, Wi-Fi 6 chips in 2021
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
Tuesday 9 February 2021
Chipbond, ChipMOS to enjoy strong 1H21
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are both poised to enjoy a strong first half of 2021, driven by continued strong demand for small-size...
Tuesday 2 February 2021
DDI backend houses to further raise quotes later in 1Q21
Display driver IC (DDI) backend specialists including Chipbond Technology and ChipMOS Technologies plan to enforce a second wave of price hikes in late February or early March to...
Tuesday 19 January 2021
Lead times extend for wirebonding packaging equipment
Delivery lead times for wirebonding packaging equipment have extended to over six months, according to industry sources in Taiwan.
Tuesday 12 January 2021
Equipment makers eyeing strong demand from Taiwan OSAT firms
As Taiwan's OSAT output value is estimated to hit another record high in 2021, domestic equipment and materials suppliers are poised to embrace robust demand from the sector, according...
Tuesday 22 December 2020
Taiwan OSAT firms see clear order visibility through mid-2021
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...