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214 news items tagged Chipbond

  • huawei
    As China's leading smartphone and telecom equipment maker, Huawei is moving at full throttles to strengthen its capabilities for the upcoming 5G commercialization era by placing orders...
  • Chipbond Technology and JMC Electronics, both of whom are among the world's few suppliers of COF substrates, have reported revenue increases for 2018 of 16% and 45%, respectively.
  • The chip-on-film (COF) substrate market continues to be dominated by Korea- and Taiwan-based firms, and is considered to be niche with a high barrier of entry for startup companies,...
  • Chipbond posts record 3Q18 profit

    Thursday 1 November 2018
    LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...
  • Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.
  • Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...
  • packaging
    While China's semiconductor industry is aggressively moving to build partnerships with world-class players to strengthen its prowess amid the raging US-China trade war, Taiwan semiconductor...
  • Taiwan-based backend firm Chipbond Technology is expected to see revenues generated from orders for OLED panel driver ICs make a substantial contribution to company revenues in 2019...
  • Demand for TDDI (touch and display driver integration) chips is set to ramp up starting the third quarter, with Taiwan-based backend firms including Chipbond Technology and ChipMOS...
  • Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...
  • Chipbond+Technology+chairman+FJ+Wu++Photo%3A+Michael+Lee%2C+Digitimes%2C+June+2018
    The most important evolution in the LCD driver IC packaging sector in 2018 is that the COF (chip on film) package process has become a crucial alternative to COG (chip on glass) for...
  • Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
  • LCD driver IC backend specialist Chipbond Technology saw its net profits increase 13.1% to a three-year high of NT$2.25 billion (US$76.9 million) in 2017. EPS for the year reached...
  • The massive build-ups of OLED panel production capacity by China-based panel makers are expected to bring business opportunities for Taiwan-based makers, including driver IC designers,...
  • Taiwan%2Dbased+OSAT+players+such+as+ASE+to+face+increasing+competition+from+China
    While expecting to benefit from increasing demand for IC solutions from the IoT, AI and 5G sectors in 2018, Taiwan-based IC testing and packaging service providers are also expected...
  • COF packaging in growing demand

    Thursday 21 December 2017
    With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging...
  • With China's LCD panel industry emerging as a major supply source worldwide and demand for panels among China brand vendors of ICT products expanding significantly, Taiwan-based LCD...
  • Chipbond+chairman+Wu+Fei%2Djian
    Taiwan-based LCD driver IC packaging and testing service provider Chipbond Technology's latest strategic investment deployments in China are mainly designed to consolidate its market...
  • Chipbond+chairman+Wu+Fei%2Djain
    LCD driver IC packaging and testing service provider Chipbond Technology will sell a 53.69% stake in Chipmore Technology, its subsidiary based in Suzhou, to a group of investors consisting...
  • Chipbond posts profit growth in 3Q17

    Thursday 2 November 2017
    LCD driver IC backend specialist Chipbond Technology saw its net profits increase 37.7% sequentially to NT$702 million (US$23.3 million) in the third quarter. Net profits for the...
  • Chipbond posts record 3Q17 revenues

    Friday 13 October 2017
    Chipbond Technology's consolidated revenues climbed to a record high of about NT$5 billion (US$165.3 million) in the third quarter of 2017. Market watchers expect the company to post...
  • A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...
  • Chipbond 3Q17 revenues to hit record high

    Wednesday 6 September 2017
    Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues climb to an all-time high, according to market watchers.
  • Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...
  • Chipbond Technology, a backend house specializing in LCD driver ICs, saw its July revenues climb to a record high of NT$1.63 billion (US$53.9 million).
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Tags: Chipbond

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