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Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Tuesday 30 November 2021
3D-IC can ease the ongoing global chip shortage concerns: Interview with Cadence
The technological benefits that the 3D stacking of integrated circuits brings have the potential to ease the current chip shortage concerns, according to Cadence Design Systems. As...
Friday 26 November 2021
EDAs to play crucial role in upcoming 3D IC era
Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...
Thursday 10 December 2020
China gearing up for homegrown EDA solutions
China is stepping up the development of homegrown EDA (electronic design automation) software and systems as part of its efforts to boost self-sufficiency in semiconductor, and many...
Friday 24 July 2020
Cadence and UMC certify mmWave reference flow on 28HPC+ process for advanced RF designs
Cadence Design Systems and United Microelectronics (UMC) have jointly announced that the Cadence millimeter wave (mmWave) reference flow has achieved certification for UMC's 28HPC+...
Monday 20 January 2020
Fab toolmakers expect strong 2020
With TSMC - the world's top pure-play foundry - anticipating record-high capex levels this year, semiconductor equipment vendors particularly those engaged in TSMC's supply chain...
Thursday 12 December 2019
Global Unichip uses Cadence digital implementation and signoff flow to deliver designs for AI, HPC applications
Cadence Design Systems has announced that Global Unichip Corporation (GUC) successfully deployed its digital implementation and signoff flow and delivered advanced-node (N16, N12...
Wednesday 4 December 2019
Cadence to acquire AWR from National Instruments
Cadence Design Systems and National Instruments (NI) have announced they have entered into a definitive agreement for the former to acquire AWR Corporation, a wholly-owned subsidiary...
Wednesday 7 August 2019
Cadence and UMC collaborate on certification of analog/mixed-signal flow for 28HPC+ process
Cadence Design Systems and United Microelectronics Corporation (UMC) have jointly announced that the US-based EDA firm's analog/mixed-signal (AMS) IC design flow has achieved certification...
Wednesday 10 July 2019
Cadence tools certified for Samsung 5LPE process
Cadence Design Systems has announced that its digital full flow has achieved certification for the Samsung Foundry 5nm low-power early (5LPE) process with extreme ultraviolet (EUV)...
Thursday 16 May 2019
Samsung details 3nm gate-all-around technology
Samsung Electronics provided an update to its advanced-node process technology roadmap, including its 3nm gate-all-around (GAA) technology, during a recent company event in Santa...
Monday 29 April 2019
TSMC expands OIP cloud alliance
TSMC has announced the expansion of its open innovation platform (OIP) cloud alliance, with Mentor Graphics joining inaugural members Amazon Web Services (AWS), Cadence, Microsoft...
Monday 8 April 2019
TSMC and OIP ecosystem partners deliver complete design infrastructure for 5nm process
TSMC has announced delivery of the complete version of its 5nm design infrastructure within the Open Innovation Platform (OIP). This full release enables 5nm systems-on-chip (SoC)...
Monday 24 December 2018
2018 review and 2019 outlook: How Taiwan ICT industry can regain ground
The US-China trade war, a key threat to the global economy in 2018, will continue to play a pivotal role in 2019. But what does it mean to the world's biggest manufacturer and market,...
Thursday 16 August 2018
Cadence to open subsidiary in Nanjing
EDA vendor Cadence Design Systems is scheduled to start operating a new subsidiary in Nanjing, China in September, according to industry sources.
May 27, 10:24
Empower manufacturing with AI: Into new era of smart manufacturing with collective wisdom
Tuesday 24 May 2022
MSI unveils new lineup at Computex 2022 Online
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Thursday 19 May 2022
Computex Focus: DataVan to showcase new retail solutions for new normal
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
IC design houses bracing for cutback in orders from China handset brands
TSMC to move CoWoS-L technology to commercial production in 2 years
Intel makes key investments to advance datacenter sustainability
Concerns rising over potential foundry overcapacity in 2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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