73 news items tagged bumping
PTI set to boost logic IC backend revenue ratio to 50% in mid-2021
Wednesday 27 January 2021Memory backend specialist Powertech Technology (PTI) is gearing up to expand its business in the logic IC field in 2021 with focus placed on flip-chip packaging and bumping services,...
OSE seeking logic chips backend orders after allying with Chipbond
Thursday 7 January 2021Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Chipbond to expand backend capacity for RF, PA devices, driver ICs
Friday 4 December 2020Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
Monday 26 October 2020The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
PTI to gear up logic IC backend business expansion
Friday 23 October 2020Backend house Powertech Technology (PTI) will step up efforts to expand its logic IC business, aiming to boost the revenue ratio for the segment from nearly 30% to over 40%, according...
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Tuesday 20 October 2020Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Backend demand for consumer logic chips picking up
Tuesday 11 August 2020Taiwan-based IC backend houses including ASE Technology and Powertech Technology (PTI) have seen orders placed by game console and other consumer electronics vendors ramp up since...
Top China backend firms gaining significant expansion momentum
Friday 17 July 2020China's top-3 backend houses JCET, Huatian Technology and Tongfu Microelectronics, now all among the world's top-10 IC assembly and testing firms, are gaining increasing business...
TSMC may move mature CoWoS tech to US fab, say sources
Monday 18 May 2020As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
SJSemi strengthens presence in wafer-level 3D packaging segment
Friday 3 January 2020SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
China IC backend firms poised for strong 2020
Thursday 24 October 2019China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
JCET kicks off 12-inch wafer bumping production in S Korea
Wednesday 31 July 2019Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
SJSemi rolls out AiP technology for 5G and millimeter waves
Wednesday 20 March 2019SJ Semiconductor (SJSemi) has unveiled its ultrawideband dual-polarization antenna-in-package (AiP) technology for 5G millimeter-wave applications.
China IC packager Tongfu sets up new fab in Xiamen
Thursday 26 July 2018As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation...
SPIL 1Q18 profits fall to 9-quarter low
Wednesday 25 April 2018IC packaging specialist Siliconware Precision Industries (SPIL) has reported net profits of NT$240 million (US$8.1 million) for the first quarter of 2018, down 83.9% sequentially...
SPIL spends NT$710 million on equipment for China subsidiary
Friday 9 February 2018IC packager Siliconware Precision Industries (SPIL) has disclosed it has spent a total of NT$710.71 million (US$24.3 million) on equipment from Kulicke and Soffa Industries for its...
ASE expects revenues to pick up starting 2Q18
Friday 2 February 2018Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...
Logic IC packager Greatek upbeat about revenues for 2018
Wednesday 31 January 2018After scoring impressive revenue and profit records in 2017, Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI) , is quite optimistic...
Taiwan IC packagers to cash in on mining craze in 2018
Tuesday 30 January 2018Taiwan IC backend service providers including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYE), are upbeat about their...
SPIL posts EPS of NT$2.21 for 2017
Monday 29 January 2018IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits fall 30.5% on year to NT$6.9 billion (US$237 million) in 2017. EPS for the year came to NT$2.21...
ChipMOS lands orders from new clients for gold bumping services
Wednesday 17 January 2018Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...
Backend IC service provider Sigurd sees bright prospect in 2018
Tuesday 5 December 2017Taiwan-based IC packaging and testing house Sigurd Microelectronics is expected to enjoy strong revenue performance in 2018 due to more orders from Amazon for its smart speaker chips,...
ChipMOS Shanghai to grab backend orders for China homegrown 3D NAND chips
Friday 24 November 2017ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...
SPIL posts EPS of NT$1.74 for 1Q-3Q17
Wednesday 25 October 2017IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits for the first three quarters of 2017 decline 23.8% from a year earlier to NT$5.41 billion (US$178.7...
Chipbond posts record 3Q17 revenues
Friday 13 October 2017Chipbond Technology's consolidated revenues climbed to a record high of about NT$5 billion (US$165.3 million) in the third quarter of 2017. Market watchers expect the company to post...