Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Memory backend specialist Powertech Technology (PTI) has recently obtained wafer bumping orders for networking chips from Broadcom and MediaTek, indicating a significant payoff in...
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Taiwan's leading OSAT firm ASE Technology Holding will raise its capex budget by 10-15% to up to US$2 billion for 2021, from the previous estimation of US$1.7 billion, according to...
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...
Memory backend specialist Powertech Technology (PTI) is gearing up to expand its business in the logic IC field in 2021 with focus placed on flip-chip packaging and bumping services,...
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Backend house Powertech Technology (PTI) will step up efforts to expand its logic IC business, aiming to boost the revenue ratio for the segment from nearly 30% to over 40%, according...
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Taiwan-based IC backend houses including ASE Technology and Powertech Technology (PTI) have seen orders placed by game console and other consumer electronics vendors ramp up since...
China's top-3 backend houses JCET, Huatian Technology and Tongfu Microelectronics, now all among the world's top-10 IC assembly and testing firms, are gaining increasing business...
As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
