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Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Wednesday 15 September 2021
Vanchip tapping Wi-Fi 6 RF FEM market
China-based Vanchip Technologies, a subsidiary of MediaTek, is partnering with IC distributor WPG and GaAs foundry Win Semiconductors to promote its Wi-Fi 6 RF front-end modules (RF...
Wednesday 8 September 2021
Networking device makers see order visibility extended to 1H22
Taiwan-based networking device manufacturers including Accton Technology, Arcadyan Technology and Sercomm have enjoyed clear order visibility through the first half of next year,...
Monday 23 August 2021
Samsung regains top spot in 2Q21 chip rankings
Samsung Electronics replaced Intel as the number one quarterly semiconductor supplier in the second quarter of 2021, according to IC Insights.
Monday 16 August 2021
Vietnam's semiconductor industry expected to reach US$6.16 billion in 2024
According to market research firm Technavio, Vietnam's semiconductor industry is projected to grow at nearly 19% CAGR, about US$6.16 billion, between 2020 to 2024. The semiconductor...
Thursday 15 July 2021
GaAs IC firms to see strong PA demand for 5G handsets,Wi-Fi 6E devices in 2H21
GaAs IC foundries Win Semiconductors and Advanced Wireless Semiconductor Company (AWSC), and GaAs epi-wafer supplier Visual Photonics Epitaxy Company (VPEC) are all poised to log...
Thursday 1 July 2021
Skyworks to increase outsourcing for PA orders from China
Skyworks will be stepping up its RF power amplifier (PA) production outsourcing to Taiwanese partners to fulfill orders placed by China-based smartphone vendors, while providing its...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Friday 25 June 2021
PTI obtains new bumping orders for logic chips
Memory backend specialist Powertech Technology (PTI) has recently obtained wafer bumping orders for networking chips from Broadcom and MediaTek, indicating a significant payoff in...
Tuesday 1 June 2021
Chipmakers keen on developing Wi-Fi 7 chips
Chipmakers including Broadcom, Qualcomm and MediaTek have entered the early stages of developments for their respective Wi-Fi 7 (802.11be) chips, according to industry sources.
Tuesday 25 May 2021
Pure-play foundries expanding capacity with prepayments from clients
TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
Monday 3 May 2021
TSMC ramping 28nm chip output despite cutback in orders from Sony
Despite weakened orders from Sony, TSMC still has been ramping up its 28nm chip output with plans to build additional production capacity at its Nanjing fab in China, according to...
Friday 23 April 2021
TSMC to expand capacity for 28nm process at China fab
TSMC's board of directors has approved a budget of about US$2.89 billion for installation of mature technology capacity, the pure-play foundry announced on April 22.
Monday 12 April 2021
Wi-Fi 6E chips to bring business for test, certification labs in 2H21
Chipmakers are set to roll out Wi-Fi 6E chip solutions in the second half of the year, bringing new business opportunities for IC test and certification labs including Sporton Inte...
Tuesday 16 March 2021
Networking chip supply getting tight
Some networking chip vendors, such as Broadcom, have extended their delivery lead times to as long as 50 weeks due to the tight supply of critical parts and components, heralding...