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NEWS TAGGED BOOK-TO-BILL
Thursday 28 October 2021
Yageo sees mixed prospects for specialty, commodity passive components
Taiwan's leading passive components maker Yageo continues to enjoy strong demand for automotive and industrial applications, but its capacity utilization rate for commodity offerings...
Thursday 16 September 2021
Taiwan LCD driver IC suppliers say orders remain strong
Some Taiwan-based LCD driver IC suppliers have claimed their book-to-bill ratios remain above one with clear order visibility through the end of this year and even 2022, in response...
Thursday 9 September 2021
Taiwan 1st-tier IC design houses poised to raise prices in 1Q22
With delivery lead times at TSMC extended to 4-5 months, Taiwan's first-tier IC design houses have notified customers about further price hikes for their chip solutions starting the...
Monday 6 September 2021
IC design houses set to slow down shipments in 4Q21
Taiwan IC design houses are expected to slow down their shipments in the fourth quarter of the year, as downstream clients have recently started to soften their shipment pull-in momentum,...
Thursday 18 February 2021
Packaging quotes for MCU and other consumer ICs set to rise
Packaging specialists, such as Greatek Electronics, plan to raise their quotes for MCU and other consumer IC products in the second quarter to reflect their tight capacities, according...
Wednesday 15 April 2020
Chip resistors see tightest supply with BB ratio hitting 1.8
Chip resistors are seeing the tightest supply among passive components with book-to-bill ratios at suppliers rising to 1.8, higher than 1.5 for MLCCs, and major makers Yageo, Walsin...
Wednesday 25 January 2017
US fab tool book-to-bill ratio rises to 7-month high
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 1.06 in December 2016, the highest in seven months, compared with 0.96 in the prior month and 1.00...
Friday 16 December 2016
NA semiconductor equipment industry posts November book-to-bill ratio of 0.96, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2016, compared with 0.91 in the prior month and 0.96 a year ago, according...
Wednesday 23 November 2016
US fab tool book-to-bill ratio slips below parity
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.91 in October 2016 after having stayed above parity for 10 straight months.
Tuesday 22 November 2016
Japan chip gear orders rise 7% in October, says SEAJ
Japan-based semiconductor equipment manufacturers posted JPY139.3 billion (US$1.3 billion) in orders in October 2016 (three-month average basis), up 7.3% from JPY129.85 billion in...
Monday 24 October 2016
North American semiconductor equipment industry posts September book-to-bill ratio of 1.05
North America-based semiconductor equipment manufacturers posted US$1.60 billion in orders worldwide in September 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...
Monday 19 September 2016
US fab-tool book-to-bill ratio stays above parity, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.03 in August 2016, having been above parity for nine months in a row, according to the...
Wednesday 24 August 2016
US fab-tool book-to-bill ratio rises, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.15 in July 2016, having been above parity for eight months in a row, according to the...
Friday 22 July 2016
Fab tool book-to-bill slips
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.00 in June, down from 1.09 in May, according to SEMI.
Monday 20 June 2016
North American semiconductor equipment industry posts May 2016 book-to-bill ratio of 1.09, says SEMI
The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the sixth consecutive month in May 2016, according to industry association SEM...