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NEWS TAGGED BGA
Thursday 23 June 2022
Automotive CIS backend may incorporate RW technology
Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry so...
Friday 1 April 2022
IC test interface vendors diversifying into non-handset chip segments
Taiwan's IC test interface specialists including Chunghwa Precision Test Tech (CHPT) are striving hard to strengthen deployments in multiple market segments beyond handsets as demand...
Monday 28 March 2022
IDMs, backend partners expanding automotive CIS capacity
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Wednesday 1 December 2021
Supply chain cooperation crucial to address SiP challenges, says ASE VP
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
Wednesday 17 November 2021
Eternal Materials sees demand for high-end IC substrates remain strong
Eternal Materials, which specializes in resin materials and dry-film photoresists, continues to enjoy strong shipments for high-frequency and high-speed substrates, while seeing orders...
Thursday 7 October 2021
Packaging leadframe supply stays tight with order visibility clear till 2023
The supply of leadframes for chip packaging has been tight, with the visibility of orders from international IDMs for automotive and industrial applications extended to 2023, according...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Friday 11 June 2021
ASE Technology posts record revenues for May
ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Tuesday 16 March 2021
IC and material distributors to embrace strong 2Q21
Taiwan-based distributors of ICs and materials continue to see strong influx of orders, which will buoy their sales performance through the second quarter, according to industry so...
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...