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Wednesday 27 July 2022
Micron kicks off volume production of 232-layer NAND
Micron Technology has kicked off volume production of what the company claims is the world's first 232-layer NAND flash memory.
Tuesday 14 June 2022
Geared up for DDR5 transition: Q&A with Micron EVP Sumit Sadana
The transition to DDR5 memory in the data center sector will be taking place in 2022, and Micron Technology is gearing up for the robust demand, according to Sumit Sadana, executive...
Friday 10 June 2022
SK Hynix to supply HBM3 DRAM to Nvidia
Nvidia has recently completed its performance evaluation of SK Hynix's HBM3 samples, according to the memory chipmaker. SK Hynix will provide HBM3 for Nvidia systems expected to ship...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Wednesday 25 May 2022
Global top-3 DRAM makers hold 94% of 2021 market
Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Thursday 5 May 2022
Silicon Labs working closely with Taiwan foundries, OSATs
Silicon Labs, a US-based wireless SoC and MCU provider, continues to work closely with its Taiwan-based foundry and OSAT partners to improve its delivery lead times, according to...
Friday 22 April 2022
TSMC sets timetable to commercialize 2nm GAA process in 2025
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Thursday 14 April 2022
Micron shipping 16Gb GDDR6X for new Nvidia graphics card
Micron Technology has announced the volume production of its new 16Gb GDDR6X memory, which is now shipping in the Nvidia GeForce RTX 3090 Ti graphics card.
Friday 11 March 2022
Ayar Labs announces additional traction for silicon photonics
Ayar Labs has announced it is partnering with Lumentum, the largest manufacturer of optical and photonics products, to deliver CW-WDM MSA compliant external laser sources in high...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Thursday 30 December 2021
Nanya to break ground for new DRAM plant in 1H22
Nanya Technology plans to break ground for a new DRAM plant in the first half of 2022 in an effort to meet growing market demand, and expects to invest a total of NT$300 billion (US$10.86...
Tuesday 14 December 2021
5G private networks expected to go online in Taiwan in 2022
The government in Taiwan is expected to issue operating licenses for 5G private networks to qualified enterprise applicants in 2022, and related players are stepping up preparations...