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NEWS TAGGED AUTOMOTIVE
Friday 15 October 2021
Highlights of the day: Automotive IC shortages to remain
The car industry has been plagued by component shortages, and automotive IC shortages are likely to last till at least...
Friday 15 October 2021
Chip shortage causes uneven inventories, says Acer chairman
Notebook inventories held by Acer's channel distributors are pretty low. The PC vendor still has a large backlog of orders from international distributors as uneven inventories across...
Friday 15 October 2021
Automotive IC shortage to persist for next 2-3 years
The global shortage of automotive ICs is likely to last beyond next year until 2023 or even 2024, and automakers worldwide are trying all possible means to counter, according to industry...
Friday 15 October 2021
Will foundry expansions lead to capacity glut?
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
Thursday 14 October 2021
TSMC expects 4.5% revenue growth in 4Q21
TSMC expects to post revenues of between US$15.4 billion and US$15.7 billion in the fourth quarter of 2021, which is a 4.5% sequential increase at the midpoint. Gross margin and operating...
Thursday 14 October 2021
Power and compound fab capacity to top 10 million wafers monthly in 2023, says SEMI
Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions, worldwide installed capacity for power and compound semiconductor fabs is projected...
Wednesday 13 October 2021
DDI backend firms expect flat growth in 4Q21
Taiwan-based display driver IC (DDI) backend specialists expect to post flat sequential revenue growth in the fourth quarter of 2021, as tight foundry capacity constrains their fabless...
Wednesday 13 October 2021
Taiwan DDI suppliers poised to generate significant revenue increases in 2021
Despite uncertainty emerging over the demand outlook for the fourth quarter, Taiwan-based display driver IC (DDI) specialists are all poised to generate signifiant revenue increases...
Wednesday 13 October 2021
Taiwan backend houses gain shifted orders for MOSFETs from Southeast Asia
Taiwan-based backend houses continue to land shifted orders for MOSFET and other power ICs from Southeast Asia, where operations at fabs run by international IDMs are being disrupted...
Wednesday 13 October 2021
Passive component makers conservative about 4Q21
Most Taiwan makers of passive components are conservative about their revenue performance for the fourth quarter of 2021 due to power cuts in China and the seasonality, according...
Tuesday 12 October 2021
VPEC rises as top GaAs epiwafer supplier
Taiwan-based epiwafer maker Visual Photonics Epitaxy (VPEC) has emerged as the world's top supplier of GaAs epiwafers with its market share in the segment surpassing that of British...
Friday 8 October 2021
Foxconn enters US EV market after announcing acquisition of Lordstown's factory
Granted access to the local EV market in the US by acquiring Lordstown Motors' Ohio factory, Foxconn will be producing Lordstown's Endurance electric truck and will be able to provide...
Friday 8 October 2021
Rich nickel resources make Indonesia a potential manufacturing hub for EV battery
Indonesia is poised to become the top electric vehicle (EV) battery supply base among all Southeast Asian countries, thanks to abundant mineral reserves and incoming foreign investment...
Thursday 7 October 2021
Most Taiwan III-V IC makers log big revenue gains for 3Q21
GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) and epi-wafer supplier Visual Photonics Epitaxy Company (VPEC) have all reported impressive revenue gains...
Thursday 7 October 2021
Packaging leadframe supply stays tight with order visibility clear till 2023
The supply of leadframes for chip packaging has been tight, with the visibility of orders from international IDMs for automotive and industrial applications extended to 2023, according...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.