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NEWS TAGGED AUTOMOTIVE
Wednesday 25 May 2022
Global top-3 DRAM makers hold 94% of 2021 market
Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...
Wednesday 25 May 2022
NXP soon to roll out new-gen 5nm automotive processor
Kurt Sievers, president and CEO of NXP Semiconductors, said during his keynote at Computex 2022 that the company is about to complete the development of its new-generation automotive...
Tuesday 24 May 2022
EOI reschedules car lights production at new US plant
LED automotive lighting module maker Excellence Optoelectronics (EOI) expects to kick off volume production at its new plant in the US state of Michigan in the fourth quarter of 2022,...
Tuesday 24 May 2022
MediaTek unveils 6nm Wi-Fi 7 chip solutions
MediaTek has unveiled a series of Wi-Fi 7 chip solutions, reportedly built using TSMC's 6nm process technology.
Monday 23 May 2022
Mitac stays positive about enterprise demand in 2022
Despite rising global inflation, IT product demand from the enterprise segment remains robust, especially for servers and telecom equipment, according to Mitac Holdings president...
Friday 20 May 2022
China homegrown self-driving chips gaining ground in EV market
China's homegrown high-end autonomous driving chips have seen a significant breakthrough in commercial applications, as Chinese AI chip startup Horizon Robotics has over the past...
Thursday 19 May 2022
Macroblock expects 2-digit sales growth in 2Q22
LED driver IC design house Macroblock expects to post a double-digit sequential revenue increase with high gross margin in the second quarter of 2022, driven by robust demand for...
Thursday 19 May 2022
Commodity MOSFET inventories rising
Commodity MOSFET chip inventories have been rising, with related suppliers likely to come under pressure to offload their stockpiles starting the fourth quarter of 2022, according...
Thursday 19 May 2022
Six-inch fab capacity to stay full utilized through 3Q22
Six-inch IC foundries, such as Mosel Vitelic and Nuvoton Technology, continue to run their fabs at full capacity utilization despite a recent slowdown in orders for LCD driver chips...
Wednesday 18 May 2022
Everlight expects automotive miniLED BLU shipments to rise in 2H22
LED chipmaker Everlight Electronics expects shipments of its miniLED backlight units (BLU) for automotive displays to rise in the second half of 2022, when its Taiwan production capacity...
Tuesday 17 May 2022
Actron, Eris eyeing IDM-like operations for car, industrial power devices
Taiwan-based power semiconductor suppliers including Actron Technology and Eris Technology are aggressively utilizing manufacturing and supply-chain resources from their affiliated...
Tuesday 17 May 2022
Renesas intros automotive ECU virtualization solution platform
Renesas Electronics has announced an integrated automotive ECU virtualization platform that enables designers to integrate multiple applications into a single ECU that are safely...
Monday 16 May 2022
Taiwan OSATs embracing more car, industrial IC orders from IDMs
International IDMs including Infineon and STMicroelectronics continue stepping up production of automotive, industrial control and networking chips to meet ever-rising demand, outsourcing...
Monday 16 May 2022
Novatek, Realtek eyeing more foundry capacity for non-consumer chips
Taiwan's first-tier IC design houses Novatek Microelectronics and Realtek Semiconductor are seeking more capacity support from foundry partners TSMC and UMC to fulfill new orders...
Friday 13 May 2022
Japan MLCC makers see strong demand from emerging industries
Japan-based multi-layer ceramic capacitor (MLCC) suppliers are seeing robust demand from emerging industries, such as 5G, AIoT, and future vehicles, according to industry sources.
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.