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NEWS TAGGED ASE
Friday 1 October 2021
ASE Technology launches MicroSiP solution dedicated for wearables
OSAT ASE Technology has launched MicroSiP packaging solutions designed specifically for TWS earbuds and other wearable devices, according to industry sources.
Thursday 30 September 2021
Taiwan OSATs grab huge orders from Renesas
OSATs including Ardentec, ASE Technology, King Yuan Electronics (KYEC) and Powertech Technology (PTI) have landed significant backend orders for automotive MCUs from Japan's Renesas...
Wednesday 29 September 2021
Backend firms optimistic about demand for smartphone APs in 1Q22
Backend firms have received engineering samples of next-generation smartphone APs from vendors such as Qualcomm and MediaTek, and expect a particularly strong first-quarter 2022 for...
Monday 27 September 2021
OSATs in Suzhou concerned more about labor shortage than power reduction
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
Friday 24 September 2021
MediaTek urged to lead Taiwan mmWave 5G chips supply chain
Taiwan's makers of RF and PA devices hope MediaTek can lead the local supply chain to meet competition from Qualcomm in tapping the mmWave 5G market, according to industry sources...
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Friday 3 September 2021
Backend firms see robust demand for MEMS microphones, audio ICs
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Monday 30 August 2021
OSATs to sustain tight testing capacity well into 2022
Taiwan's OSATs are expected to sustain tight capacity supply for chip probing and final test operations through 2022, as the visibility of their orders, particularly from international...
Monday 30 August 2021
Taiwan chip vendors to gain influence in 2022 with major advantages
Taiwan chip vendors including MediaTek will continue to play an influential role in the global high-tech sectors in 2022 with major advantages including strong IC design prowess,...