Taiwan's MCU vendors will see their revenue growth momentum constrained in the short term by extended delivery lead times at foundry and backend houses, although they have abundant...

Wafer probing service providers have seen the visibility of orders for automotive chips extended to the end of 2021, as TSMC has committed capacity support to chip vendors, according...

OSATs have been notified by their Japan-based packaging materials suppliers including Showa Denko about a potential supply shortfall of as much as 50% between May and June, according...

Some Taiwan-based IC distributors and testing service vendors in AMD's supply chain are benefiting significantly from robust sales of the US firm's HPC (high-performance computing)...

Taiwan's leading OSAT firm ASE Technology Holding will raise its capex budget by 10-15% to up to US$2 billion for 2021, from the previous estimation of US$1.7 billion, according to...

ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...

Qualcomm and MediaTek are both considering adopting fan-out PoP in the production of their flagship smartphone application processors, following in the footsteps of Apple utilizing...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing...

Taiwan's backend houses are relatively conservative about capex expansions, compared to foundry houses and fabless firms' eagerness in inceasing spending, according to industry sou...

Apple is stepping up development its own dual-band 5G AiP (antenna in package) module, which, along with Qualcomm's solutions, may be featured in its next-generation iPhones, according...

Taipei AMPA (Automobile and Motorcycle Parts and Accessories) and Autotronics Taipei are being held from April 14-17 with a total of 380 exhibitors showcasing their latest automotive...

TSMC's bold US$100 billion capex plan for the next three years has greatly boosted the confidence of its ecosystem partners about bright prospects for the semiconductor industry,...

Backend houses continue to enjoy strong demand for processing IP camera chips and CMOS image sensor (CIS) chips, with their order visibility clear through the fourth quarter of 2021,...

Backend firms including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE) continue to enjoy strong packaging demand for...

Prices for packaging-use epoxy molding compounds (EMC) will rise 10% starting April and supply shortages are expected to persist through the end of 2021 at least, according to Chang...

Japan-based semiconductor equipment vendor Tokyo Electron is reportedly eyeing the acquisition of a 6-inch wafer fab in Taiwan that has been put up on sale, while fellow companies...

Backend house ASE Technology has kicked off optical sensors production for the next-generation AirPods slated for launch in the third quarter of 2021, according to industry sources...

IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...

Backend houses ASE Technology and ShunSin Technology are both expected to enjoy a surge in orders for optical communication modules for 5G device applications starting the second...

TSMC, United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) continue to run at full capacity for their 28nm and...

Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.

Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...

Taiwan's IC designers are facing increasingly tight capacity and resultant quote hikes at their backend partners though foundry capacity they booked in fourth-quarter 2020 are being...

Taiwan's first-tier IC designers including MediaTek, now facing increasingly tight capacity support from domestic backend houses, are expected to release some orders to Chinese OSATs...

Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...