Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors,...
Fab toolmaker All Ring Tech has landed significant orders from chipmakers, such as TSMC and ASE Technology, which have stepped up their advanced packaging capacity expansions, according...
International IDMs including Infineon and STMicroelectronics continue stepping up production of automotive, industrial control and networking chips to meet ever-rising demand, outsourcing...
ASE Technology has landed big orders from Qualcomm and MediaTek for processing their Wi-Fi-Fi SoCs with its unique aQFN (advanced quad flat no-lead) technology, and is actively seeking...
Silicon Labs, a US-based wireless SoC and MCU provider, continues to work closely with its Taiwan-based foundry and OSAT partners to improve its delivery lead times, according to...
Taiwan-based OSAT ASE Technology expects demand for automotive, HPC and network ICs to stay robust and buoy further its sales performance in the second quarter and the second half...
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Taiwan-based OSATs including ASE Technology have said their local manufacturing operations in Suzhou remain normal despite the city entering a COVID-induced semi-lockdown, but they...
Intel reportedly is mulling expanding its outsourced backend operations to include PC-use chipsets, and Powertech Technology (PTI) is expected to become the first Taiwan-based OSAT...
