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Thursday 9 September 2021
Yo-Kai Express uses IoT and AI to remove barriers to gourmet food
After 12 years as an engineer and salesperson in the semiconductor industry, Andy Lin founded Yo-Kai Express, a food technology startup. Lin has integrated Internet-of-Things (IoT)...
Monday 30 August 2021
NATEA and TTA SV to hold pitchoff event on September 9-10
North American Taiwanese Engineering Association (NATEA) and Taiwan Tech Arena Silicon Valley (TTA SV), a startup ecosystem-building program sponsored by the Ministry of Science and...
Friday 20 August 2021
Intel unveils new chip architectures; expands partnership with TSMC
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...
Monday 9 August 2021
Law firms in Taiwan consider using Lawnote's AI for work efficiency
Taiwan's Lawsnote was the first law tech startup whose solutions were adopted by financial institutions and legal departments in tech firms in Taiwan.
Monday 26 July 2021
Asian countries see mixed 5G progresses
5G subscriptions are growing at a rate of about one million per day. 5G is expected to become the fastest adopted mobile generation in history, compared to 4G LTE. It is estimated...
Friday 23 July 2021
Strong demand for panels boosts Taiwan optoelectronics industry
Taiwan's optoelectronics industry in the first half of 2021 shows strong growth, compared to the same period in 2020, due to the large-scale stimulus plans from major economies and...
Friday 2 July 2021
Micron to sell Lehi fab to Texas Instruments
Micron Technology has entered into a definitive agreement to sell its Lehi, Utah fab to Texas Instruments (TI), according to the US memory chip vendor.
Wednesday 23 June 2021
Globalfoundries breaks ground for new fab in Singapore
Globalfoundries on June 22 broke ground for a new 12-inch wafer fab at its Singapore campus, according to the pure-play foundry.
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Tuesday 4 May 2021
Intel to invest US$3.5 billion to boost advanced packaging technologies
Intel has announced plans to invest US$3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including its Foveros...
Friday 26 March 2021
PSMC breaks ground for new 12-inch wafer fab in northern Taiwan
Pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) broke ground for a new 12-inch wafer fab at the Tongluo campus of the Hsinchu Science Park (HSP) on March 25.
Friday 26 March 2021
Samsung develops HKMG-based DDR5 memory
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology, according to the company.
Wednesday 17 March 2021
Micron to shift resources from 3D XPoint to CXL memory
Micron Technology has announced updates to the company's portfolio strategy to further strengthen its focus on memory and storage innovations for the data center, with plans to cease...
Tuesday 23 February 2021
Samsung develops high bandwidth memory with built-in AI processing
Samsung Electronics has developed high bandwidth memory (HBM) integrated with artificial intelligence (AI) processing power, dubbed HBM-PIM, according to the company. The new processing-in-memory...
Friday 19 February 2021
Kioxia, Western Digital announce 6th-gen 3D flash memory
Kioxia and Western Digital jointly announced they have developed their sixth-generation, 162-layer 3D flash memory technology.