Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process. The new Exynos 9610 supports deep learning-based visual processing, 480 fps slow-motion recording and other multimedia features in high-end smartphones, the company noted. Samsung's Exynos 9610 SoC consists of four Cortex-A73 cores clocked at 2.3GHz and four ARM Cortex-A53 cores running at 1.6GHz, and features the second-generation Bifrost-based ARM Mali-G72 GPU. Samsung expects to enter mass production of the Exynos 7 Series 9610 chips in the second half of 2018.

Toshiba has announced the launch of three new application processors (APs) under its TZ2100 group as the latest additions to its ApP Lite family's ARM Cortex-A9-based TZ2000 series. The TZ2100 APs are high performance application processors supporting enhanced sound and image data-mining, communications and security functions. Sample shipments will start from mid-December, with mass production scheduled to start in June, 2015.

Interconnect solution supplier Mellanox Technologies has announced the ConnectX-4 single/dual-port 100Gb/s virtual protocol interconnect (VPI) adapter, an end-to-end 100Gb/s InfiniBand interconnect solution. Doubling the throughput of the previous generation, the ConnectX-4 adapter delivers the consistent, high-performance and low latency required for high performance computing (HPC), cloud, Web 2.0 and enterprise applications to process and fulfill requests in real-time, according to the vendor. Mellanox's ConnectX-4 VPI adapter delivers 10, 20, 25, 40, 50, 56 and 100Gb/s throughput supporting both the InfiniBand and the Ethernet standard protocols, and the flexibility to connect any CPU architecture - x86, GPU, POWER, ARM, FPGA and more. With performance at 150 million messages per second, latency of 0.7usec, and smart acceleration engines such as RDMA, GPUDirect and SR-IOV, the ConnectX-4 will enable efficient compute and storage platforms.