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Three Mirrowed In-House Testing Labs
Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED ANTENNA-IN-PACKAGE
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 17 September 2021
AiP substrate shipments for new iPhones set to rise
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
Tuesday 7 September 2021
Nan Ya PCB to enjoy sales growth through 4Q21
Taiwan-based IC substrate maker Nan Ya PCB is poised to generate sequential revenue increases through the fourth quarter of 2021, as robust ABF-based as well as BT substrate demand...
Thursday 29 July 2021
Taiwan supply chain gearing up shipments for new iPhones
TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Tuesday 24 November 2020
Sigurd counts on 5G chips for sustained growth in 2021
Testing house Sigurd Microelectronics is optimistic about its business outlook for 2021, as testing demand for related chips for 5G phone, networking, automotive and AI applications...
Tuesday 17 November 2020
CHPT, Xintec positive about 4Q20 on strong shipments for Apple devices
Taiwan's top test interface specialist Chunghwa Precision Test Tech (CHPT) and TSMC's re-invested backend house Xintec are both optimistic about their revenue prospects for fourth-quarter...
Friday 6 November 2020
ASE, Win Semi cut into supply chain for new Qualcomm chips
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
Monday 5 October 2020
5G notebook development gains momentum
First-tier chip designers and PC brand vendors have begun cooperation to develop notebooks with integrated antenna-in-package (AiP) modules to support both sub-6GHz and mmWave 5G...
Thursday 27 August 2020
Taiwan makers poised to scale up AiP substrate shipments in 2021
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
Wednesday 22 January 2020
Taiwan IC backend houses to expand production capacity
Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according...
Thursday 16 January 2020
IC substrate makers to gain from AiP modules for Apple 5G devices
Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...
Wednesday 15 January 2020
ASE reportedly enters supply chain for mmWave 5G iPads, iPhones
Taiwan's backend leader Advanced Semiconductor Engineering (ASE) has reportedly broken into the supply chain for Apple's mmWave 5G iPhones and 5G iPads with its substrate-based FC_AiP...
Friday 27 December 2019
TSMC to launch InFO-AiP volume production for mmWave devices in 2020
TSMC's backend antenna-in-package technology, dubbed InFO-AiP, has attracted orders from US-based clients for packaging 5G mmWave devices, with volume production set to kick off next...
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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