ABF substrate suppliers have secured orders set to be fulfilled through 2023 and beyond, as major HPC chips vendors Intel, AMD, Nvidia and 5G networking chips supplier Xilinx have...
Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...
Taiwan-based leading PCB maker Zhen Ding Technology and Austria's AT&S are set to enter the high-end ABF substrate segment where demand will stay robust through 2025, both making...
ABF substrate supply is likely to remain short of demand through 2023 although makers in Taiwan, Japan and South Korea have all geared up capacity expansions at the request of chipmaking...
Intel's acquisition of Globalfoundries is unlikely, as GF's manufacturing capability that is more focused on mature and specialty process technology contradicts Intel's ambition of...
Intel is reportedly eyeing Globalfoundries for acquisition valued at an estimated US$30 billion. Will the acquisition be a good buy and follow Intel's IDM 2.0 strategy that was unveiled...
Nan Ya PCB and Kinsus Interconnect Technology both saw their June revenue climb over 30% from a year earlier, driven mainly by the arrival of new production capacity, according to...
Pure-play foundry United Microelectronics (UMC) saw its revenue reach a record high for the second consecutive month in June. Revenue for the second quarter came to NT$50.91 billion...
Taiwan's PCB maker Zhen Ding Technology has disclosed plans to set up four new plants in Taiwan and China in 2021, mostly dedicated to production of high-end IC substrates and rigid...
Foundry market leader TSMC has been pinpointed as a major beneficiary of the increasingly fierce competition among HPC chip providers, according to market sources.
Notebook ODMs and brand vendors continue to see their shipments constrained by chip shortages, though supply of some other components may improve later this year, according to industry...
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Speculation is circulating in the chipmaking industry that vendors including Intel, AMD, Qualcomm and MediaTek expect their shipments for Chromebooks to continue growing but at a...
