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NEWS TAGGED ADLINK
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Industries such as semiconductors and panel manufacturing, which the world depends on, implement cleanrooms to prevent contaminants such as microorganisms, suspended particles, volatile...
Thursday 20 January 2022
ADLINK and AU Optronics partner up using edge visualization to perfect smart application services
Displays are the last mile for communication between human and machine. In recent years, a wave of smart digitization has taken global industries by storm, as companies in the vehicle,...
Wednesday 12 January 2022
ADLINK releases its first SMARC module based on Qualcomm QRB5165, enabling high-performance robots and drones at low power
The LEC-RB5 SMARC is a high-performance module, built with the Qualcomm® QRB5165 processor, allowing on-device AI and 5G connectivity capabilities for consumer, enterprise, and...
Wednesday 12 January 2022
ADLINK launches first embedded MXM graphics modules based on NVIDIA Ampere architecture for edge computing and AI
ADLINK EGX-MXM-A1000, EGX-MXM-A2000 and EGX-MXM-A4500 are the first modules to use NVIDIA's embedded GPUs based on NVIDIA Ampere architecture. ADLINK embedded MXM graphics modules...
Thursday 4 November 2021
Edge computing is everywhere, says Adlink chairman
Along with progressive development of AI, 5G and IoT technologies, edge computing has become ubiquitous, marking the coming of the era of Edge, according to chairman and CEO Jim Liu...
Wednesday 3 November 2021
AUO, Adlink jointly develop edge visualization solutions for vertical applications
TFT-LCD panel maker AU Optronics (AUO) and industrial computing device maker Adlink Technology have formed a strategic partnership to develop edge visualization solutions for vertical...
Friday 15 October 2021
ADLINK assists in implementation of smart transportation, providing complete solutions with software and hardware
Self-driving cars have been listed as an important focus for development by global car and technology companies. The successful development of the technologies will not only depend...
Thursday 16 September 2021
Changes by IPC companies trigger new wave of component shortages
External circumstances and changing industry demands have continued to impact various industry chains since the second half of 2020. For IPC companies, the consensus in 2021 is that...
Tuesday 31 August 2021
IPC makers to not buy over-priced components in spot market
Advantech will stop procuring over-priced components from the spot market, except in cases where it has to serve important clients who are willing to cover all extra costs of buying...
Thursday 26 August 2021
Adlink expects revenue to top US$1 billion in 2025
Industrial computing device maker Adlink Technology expects its annual revenues grow steadily and top US$1 billion in 2025, with growth momentum mainly driven by the mounting penetration...
Wednesday 7 July 2021
ADLINK helping manufacturers upgrade businesses with private 5G network-enabled smart manufacturing solutions
5G has become one of the most anticipated technologies for manufacturers in the two recent years. This technology is regarded as being especially crucial for the coming era of enterprise...
Thursday 17 June 2021
ADLINK launches industry-first Nvidia Jetson Xavier NX-based industrial AI smart camera
ADLINK Technology Inc, global leader in edge computing, launched the NEON-2000-JNX series, the industry's first industrial...
Wednesday 16 June 2021
ADLINK launches new EtherCAT modules, completing the EtherCAT solution for industrial automation
ADLINK Technology Inc, a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO...
Tuesday 15 June 2021
ADLINK high-efficiency die sorting machine solution increases effectiveness of IC packaging and testing
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted...
Tuesday 18 May 2021
ADLINK's die bond solution helps realize fast, high-precision advanced packaging for semiconducting industry
Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons,...