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NEWS TAGGED 6-INCH WAFER
Friday 4 March 2022
6-inch fabs fully loaded for SGT MOSFETs, automotive diodes till 2Q22
Taiwan's 6-inch wafer foundry specialists including Mosel Vitelic, Nuvoton Technology and Epsil Technologies are expected to maintain full capacity utilization throughout at least...
Tuesday 15 February 2022
MCU specialist Nuvoton set to embrace strong 2022
Nuvoton Technology remains optimistic that its shipments of 32-bit MCUs, server baseboard management controllers (BMCs), automotive battery management ICs (BMICs), and power management...
Thursday 27 January 2022
Tyntek undertakes trial production at 6-inch wafer factory
LED chip and Si-based sensor chip maker Tyntek has undertaken small-volume trial production at its new factory of 6-inch epitaxial wafers and will begin volume production in the second...
Tuesday 16 November 2021
Episil returns to profit
Taiwan-based Episil, a foundry specializing in SiC power devices, returned to profitability in the first three quarters of 2021 from losses a year ago.
Tuesday 26 October 2021
Taiwan strives to create dominance in third-generation semiconductors
Countries around the world continue to respond to zero-carbon emissions policies. The EU proposed its Fit for 55 package, which aims to reduce greenhouse gas emissions by 55%. In...
Tuesday 19 October 2021
Foxconn to promote localized EV production for regional markets
Foxconn Technology (Hon Hai) is well prepared to leverage its software and semiconductor prowess to turn out more EVs with high performance and intelligence in 2022/2023, and will...
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Monday 13 September 2021
IDMs, Foxconn, BYD deepening deployments in GaN, SiC devices
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
Friday 10 September 2021
Highlights of the day: Foxconn to develop SiC components for EVs
Foxconn will start to make SiC components and IR MEMS sensors, used in EVs, at its 6-inch wafer fab in Hsinchu. The...
Friday 10 September 2021
Foxconn to make SiC components at 6-inch fab for EV, solar apps
Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Tuesday 7 September 2021
IDMs migrate to 8-inch wafer fabrication for 3rd-gen semiconductors
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Monday 9 August 2021
SiC, GaN devices to see production costs fall in next 5 years, says Infineon
Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...
Friday 6 August 2021
OSATs, power chips makers gain shifted orders from ASEAN
Shortages of automotive MOSFET and power management ICs are getting worse as many IDMs including Infinenon and On-Semi are operating at reduced capacity at their plants in Malaysia,...
Friday 6 August 2021
Foxconn gears up for automotive power IC boom
Foxconn (Hon Hai) Technology Group, through its NT$2.52 billion (US$90.67 million) acquisition of Macronix International's 6-inch wafer fab and equipment, will be able to meet a market...
Thursday 5 August 2021
Macronix and Foxconn sign pact for 6-inch wafer fab transaction
Macronix International, a vendor of non-volatile memory (NVM), and EMS provier Hon Hai Technology Group (Foxconn) have announced the signing of an agreement for the former to sell...