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NEWS TAGGED 3D
Thursday 15 July 2021
GaAs IC firms to see strong PA demand for 5G handsets,Wi-Fi 6E devices in 2H21
GaAs IC foundries Win Semiconductors and Advanced Wireless Semiconductor Company (AWSC), and GaAs epi-wafer supplier Visual Photonics Epitaxy Company (VPEC) are all poised to log...
Tuesday 29 June 2021
MIH may stretch into autonomous driving
MIH Consortium, a Foxconn-led open EV ecosystem, may extend its business tentacle into the self-driving segment as quite a few startups from the segment are now members of the alliance...
Friday 25 June 2021
YMTC 128-layer 3D NAND process yield rates lower-than-expected
Yield rates for Yangtze Memory Technologies' (YMTC) 128-layer 3D NAND flash process technology remain insufficient for commercial production, according to industry sources.
Wednesday 9 June 2021
Apple to increase VCM orders starting June for new iPhones
Taiwan-based voice coil motor (VCM) suppliers expect order pull-ins from Apple to gradually turn strong starting from June as the US brand is expected to release its next-generation...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Tuesday 1 June 2021
China makers gaining weight on Apple top-200 supplier list
China-based makers have been gaining presence in the Apple's supply chain, with 12 new makers from the country entering the vendor's newly released top-200 supplier list for 2020,...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 24 May 2021
Solidworks expects surging sales from cloud computing business in 2021
Solidworks, a developer of 3D engineering CAD software under Dassault Systemes, expects its sales from cloud computing-related businesses in 2021 to surge 6- to 7-fold from a year...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Monday 17 May 2021
Ingentec to construct new plant for chipmaking specialty gases
Chipmaking specialty gas specialist Ingentec will kick off construction of a new plant for making specialty gases used in semiconductor manufacturing later this year, according to...
Friday 14 May 2021
Apple reportedly to sharply cut VCSEL die size for 3D sensors
Apple reportedly has decided to scale down the die size by 40-50% for VCSEL chips used in 3D face ID sensors for new iPhone and iPad devices to be rolled out later in 2021, a move...
Thursday 13 May 2021
AP Memory sees IoT RAM revenue surge
AP Memory Technology, a subsidiary of Powerchip Technology specializing in customized memory chip designs and IPs, has disclosed revenue generated from orders for IoT RAM products...
Friday 30 April 2021
Vendors of 3D sensors, PA, VMC to brace for new iPhones starting June
Taiwan's 3D sensor, PA and VCM suppliers for iPhones are expected to revive their inventory-preparation momentum for new iPhones starting June following a slowdown in delivering shipments...