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NEWS TAGGED 3D
Monday 15 November 2021
OSATs for handset 3D sensors, CIS see revenues fall in October
Taiwan-based backend houses Xintec and VisEra, both in the supply chain of 3D sensors for iPhone 13 series, saw their October revenues fall sequentially on a slowdown in shipments...
Thursday 11 November 2021
Macronix developing 3D NOR flash
Macronix International is engaged in the development of 3D NOR flash memory in-house, which is expected to bear fruit within two years, according to company chairman Miin Wu.
Wednesday 3 November 2021
AP Memory posts record 3Q21 profit
AP Memory Technology, a subsidiary of Powerchip Technology specializing in customized DRAM memory designs and IPs, has reported net profits of NT$676 million (US$24.2 million) on...
Monday 1 November 2021
TPK steps into 3D printing, nano silver application
Touch solution provider TPK Holding has extended production to 3D printing and application of nano silver-based touch sensors to touch solutions, according to company president Leo...
Wednesday 27 October 2021
Macronix to scale up 3D NAND flash output in 2022
Macronix International expects to scale up substantially the output of its 48-layer 3D NAND flash memory in 2022, and is upbeat about its NOR flash chip prices that will continue...
Wednesday 22 September 2021
YMTC ready to volume produce 128-layer QLC NAND flash
China-based Yangtz Memory Technologies (YMTC) has shipped over 300 million 64-layer 3D NAND flash memory chips and is ready to volume produce 128-layer QLC (quad-level cell) NAND,...
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Wednesday 8 September 2021
IC analyzer MA-tek sees robust orders for AI chips, 3rd-gen semiconductors
IC analysis and certification lab Material Analysis Technology (MA-tek) has enjoyed a strong influx of MA (materials analysis) and FA (failure analysis) orders for AI chips and third-generation...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Tuesday 31 August 2021
TSMC launches advanced packaging for silicon photonics applications
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Tuesday 24 August 2021
YMTC sees low yield rates for 128-layer 3D NAND flash
China's Yangtze Memory Technologies (YMTC) continues to suffer from low yield rates for 128-layer 3D NAND flash manufacturing, which are estimated at only 30-40%, according to market...
Wednesday 18 August 2021
Macronix to enhance 3D NAND, advanced NOR flash offerings
Macronix International will be strengthening its 3D NAND and advanced NOR flash offerings, eyeing a bigger presence in the automotive and other niche-market sectors, according to...
Tuesday 17 August 2021
Backend houses enjoy strong influx of orders for automotive CIS
Taiwan-based backend houses, including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC), and Xintec, have seen orders from international IDMs continue ramping up for...
Friday 13 August 2021
Xintec optimistic about 3Q21
Taiwan-based CIS and 3D sensor packaging specialist Xintec has expressed optimism about its sales performance in the third quarter of 2021, thanks to a seasonal pick-up in demand...
Monday 2 August 2021
YMTC starts shipping 128-layer 3D NAND flash for China homegrown SSD
Yangtze Memory Technologies (YMTC) has kicked off mass production of 128-layer 3D NAND flash memory for a home-grown SSD series, according to industry sources.