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NEWS TAGGED 3D
Thursday 24 February 2022
Chroma expects robust sales growth for test solutions
Chroma ATE, which provides automatic and customized precision test, inspection, and measurement solutions, expects sales of its semiconductor test solutions to grow substantially...
Friday 11 February 2022
Kioxia notifies customers about shipment shortfall starting April
Kioxia has already notified its customers about a shortfall in its 3D NAND flash shipments starting April, and has stopped offering its quotes in the spot market, following a Western...
Monday 7 February 2022
MediaTek readies growth roadmaps for next three years
MediaTek has completed its growth plan for the next three years, and plans to achieve medium double-digit sales increases in multiple product lines rather than just handset SoCs,...
Monday 24 January 2022
TSMC reportedly to build new advanced packaging fab in southern Taiwan
TSMC reportedly is planning to build a new advanced packaging plant in Chiayi or Yunlin county, southern Taiwan as it is fast revising its production roadmaps in response to rapid...
Friday 21 January 2022
OmniVision enhances CIS in car, security applications
China's IC design industry has grown rapidly over the past two decades, and has gained a significant position in some segments such as CMOS image sensor (CIS) chips. Its leading CIS...
Monday 10 January 2022
AMD latest 3D desktop processor to adopt TSMC SoIC technology
AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...
Thursday 6 January 2022
YMTC promoting China homegrown SSDs
China's Yangtze Memory Technologies (YMTC) continues to grow its Zhitai-branded consumer SSDs utilizing YMTC's in-house developed 3D TLC NAND chips, with the newly-developed TiPro...
Thursday 30 December 2021
Solomon uses AI 3D vision to control robotic arms
Solomon Technology has applied AI-based 3D vision software to control the movement of multiple robotic arms to reach harmonious collaboration among them, according to company chairman...
Wednesday 29 December 2021
CHPT optimistic about probe card demand for 3D ICs
Probe card demand for 3D ICs is promising, according to IC testing interface solution provider Chunghwa Precision Test Tech (CHPT), which also claimed it will be one of the new suppliers...
Wednesday 29 December 2021
Taiwan testing and analysis companies stand out in 3D chiplet, third-gen semiconductors
Taiwan's semiconductor supply chain will bring the biggest benefits to homogeneous/heterogeneous packaging, system-level testing (SLT), as well as advanced technology for materials...
Monday 6 December 2021
Memory demand to boom for AI, says Macronix chairman
Memory demand is set to rise further, as AI applications become more widespread, according to Miin Wu, chairman for ROM and flash chipmaker Macronix International.
Wednesday 1 December 2021
Supply chain cooperation crucial to address SiP challenges, says ASE VP
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
Wednesday 1 December 2021
TSMC advanced packaging enters next phase of development, says company VP
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
Friday 26 November 2021
EDAs to play crucial role in upcoming 3D IC era
Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...