Chroma ATE, which provides automatic and customized precision test, inspection, and measurement solutions, expects sales of its semiconductor test solutions to grow substantially...
Kioxia has already notified its customers about a shortfall in its 3D NAND flash shipments starting April, and has stopped offering its quotes in the spot market, following a Western...
MediaTek has completed its growth plan for the next three years, and plans to achieve medium double-digit sales increases in multiple product lines rather than just handset SoCs,...
TSMC reportedly is planning to build a new advanced packaging plant in Chiayi or Yunlin county, southern Taiwan as it is fast revising its production roadmaps in response to rapid...
China's IC design industry has grown rapidly over the past two decades, and has gained a significant position in some segments such as CMOS image sensor (CIS) chips. Its leading CIS...
AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...
China's Yangtze Memory Technologies (YMTC) continues to grow its Zhitai-branded consumer SSDs utilizing YMTC's in-house developed 3D TLC NAND chips, with the newly-developed TiPro...
Solomon Technology has applied AI-based 3D vision software to control the movement of multiple robotic arms to reach harmonious collaboration among them, according to company chairman...
Probe card demand for 3D ICs is promising, according to IC testing interface solution provider Chunghwa Precision Test Tech (CHPT), which also claimed it will be one of the new suppliers...
Taiwan's semiconductor supply chain will bring the biggest benefits to homogeneous/heterogeneous packaging, system-level testing (SLT), as well as advanced technology for materials...
Memory demand is set to rise further, as AI applications become more widespread, according to Miin Wu, chairman for ROM and flash chipmaker Macronix International.
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
