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Friday 13 May 2022
The memory industy (5): Looking for a new biz model that can create new value
When the memory industry can no longer leverage Moore's Law to create new value, it has to find new technologies to establish a new business model that can create new economic valu...
Thursday 12 May 2022
The memory industry (4): Technology diversion between DRAM and 3D NAND flash
In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its...
Friday 29 April 2022
MA-tek enjoys robust chip analysis orders for advanced processes
IC analysis and certification lab Material Analysis Technology (MA-tek) continues to enjoy a rapid rise in analysis demand for sub-7nm chips, particularly 3/2nm process now under...
Tuesday 26 April 2022
ABF substrate makers to see new capacity boost biz results in next 3 years
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Tuesday 26 April 2022
ASE competing with leading foundries, IDMs in advanced packaging segment
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Friday 22 April 2022
TSMC sets timetable to commercialize 2nm GAA process in 2025
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
Monday 18 April 2022
Intel may farm out PC chipsets processing to OSATs in Taiwan
Intel reportedly is mulling expanding its outsourced backend operations to include PC-use chipsets, and Powertech Technology (PTI) is expected to become the first Taiwan-based OSAT...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Thursday 31 March 2022
YMTC 128-layer NAND memory gains Apple validation
China's Yangtze Memory Technologies (YMTC) has recently cleared Apple's validation for its 128-layer 3D NAND flash memory, with shipments slated to kick off in small volumes in May...
Wednesday 30 March 2022
5G PA foundry capacity utilization falls on sluggish China demand
Handset-use power amplifier (PA) inventory adjustments at Chinese vendors will last into the second quarter of the year with demand showing no signs of recovery, driving down GaAs-based...
Friday 25 March 2022
Kioxia to expand 3D flash memory production capacity
Kioxia has announced it will begin construction of a new fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan for the possible expansion of production of its...
Monday 21 March 2022
TSMC may triple CoWoS material purchases for Nvidia new HPC chips
Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements...
Friday 18 March 2022
Kioxia halts part of production lines at 3D NAND flash fab due to quake
A powerful 7.4-magnitude earthquake hit eastern Japan on March 16, prompting some companies, such as Kioxia, to halt production. The memory chip vendor has suspended part of its production...
Thursday 10 March 2022
GUC announces 2.5D and 3D multi-die APT platform for AI, HPC, networking ASICs
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D...
Thursday 24 February 2022
Chroma expects robust sales growth for test solutions
Chroma ATE, which provides automatic and customized precision test, inspection, and measurement solutions, expects sales of its semiconductor test solutions to grow substantially...