Macronix International expects to start delivering 48-layer 3D NAND flash chip samples to its customers in the third quarter of 2020, followed by volume production later this year.

Digital camera ODM Altek will supply 3D depth-sensing lens modules for use in XRSpace Mova, a 5G-based standalone VR device that XRSpace unveiled on May 26, with shipments to begin...

Far EasTone Telecommunications (FET) has disclosed it has completed proof of concept (POC) for drone-based 5G 3D spatial network optimization, a project intended to optimize spatial...

Micron Technology has announced new client solid-state drives (SSD) that bring NVMe performance to client computing applications, freeing laptops, workstations and other portables...

Macronix International is gearing up to ship its in-house developed 3D NAND memory starting the second half of 2020, according to company chairman Miin Wu.

Flash memory device controller supplier Phison Electronics has announced its support for Yangtze Memory Technologies' (YMTC) 3D NAND flash memory.

Qualcomm Technologies and BOE Technology Group have announced plans to establish a strategic collaboration to develop display products featuring Qualcomm 3D Sonic ultrasonic fingerprint...

CMOS image sensor (CIS) devices have seen a rapid surge in demand for security surveillance and video conferencing applications due to lockdowns amid the coronavirus pandemic. This,...

Yangtze Memory Technologies (YMTC) has announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform through co-working...

It was a year when global semiconductor revenue fell by the greatest percentage in at least two decades, when eight of the top-10 chip suppliers suffered revenue declines and when...

Belgium-based developer of 3D printing technology Materialise has designed a 3D printed door opener that allows people to use their arms to open and shut doors without touching the...

Unic Memory Technology, a loss-laden storage business unit under China's Tsinghua Unigroup, will be dissolved as part of the group's efforts to restructure its organization, according...

High-end high performance computing (HPC) chips solutions are entailing ever-rising packaging complexity along with their increasing applications to large-size datacenters and networking...

Micron Technology has begun sampling what the company claims is the industry's first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The...

IC backend and verification specialists in the supply chain of Apple devices have regained confidence in their revenue performances for 2020 as they are moving to deliver shipments...

The primary yardstick by which the IC industry measures its technological performance and progress remains Moore's Law that states there is a doubling of the number of transistors...

Infineon Technologies has worked with Qualcomm Technologies to develop a reference design for 3D authentication based on the latter's Snapdragon 865 Mobile Platform.

Color filter (CF) maker VisEra Technologies, a subsidiary of TSMC, will establish a new plant in Longtan, northern Taiwan and is eyeing new orders from Sony, according to industry...

Kioxia (formerly Toshiba Memory) is reportedly looking to go public by October 2020, and therefore is striving to swing back to profit, according to industry sources.

Apple is scheduled to launch its new iPad Pro series around March, but shipments are unlikely to peak until after April as their components suppliers are slowly ramping up their output...

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced it is partnering with Inkron, a manufacturer...

TSMC-reinvested backend house Xintec will see little seasonality impact on its revenues for the first half of 2020 as robust packaging demand for DOE (diffractive optical element)...

Taiwan-based compound semiconductor components makers are gearing up to fulfill shipments of PA (power amplifier), RF (radio frequency) and VCSEl devices for a new iPhone model, tentatively...

IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the market, Taiwan's...

Taiwan-based LandMark Optoelectronics, dedicated to production of epi-wafer chips for optical communications, is set to kick off volume production of 200G and 400G optical modules...