793 news items tagged 3D
TSMC on track to move 3nm process to risk production in 2021
Friday 15 January 2021TSMC is on track to move 3nm process technology to risk production in 2021 followed by volume production in the second half of 2022, according to the pure-play foundry.
Win Semi posts record 2020 revenue
Thursday 7 January 2021GaAs foundry Win Semiconductors has reported revenue climbed 18.8% on year to a record high of NT$25.37 billion (US$905.71 million) in 2020.
ToF 3D sensors to accelerate AR application ecosystem formation, says Digitimes Research
Tuesday 5 January 2021Time of flight (ToF) 3D sensors are emerging rapidly for massive consumer applications, prompting major semiconductor and optoelectronics players to join the supply chain and accelerating...
SSD supply constrained by chip shortages
Monday 21 December 2020The market for NAND flash memory remains oversupplied, but shortages of flash device controllers and passive components have constrained the supply of SSD and other related peripherals,...
Taiwan to kick off advanced IC R&D project for next decade
Tuesday 15 December 2020Taiwan's Ministry of Science and Technology (MOST) has unveiled a new R&D program designed to encourage academic research teams to develop critical technologies for sub-nanometer...
Chipmakers to ramp up 176-layer 3D NAND chip output in 2H21
Tuesday 15 December 2020Chipmakers including Micron Technology and SK Hynix have introduced the availability of their 176-layer 3D NAND flash chips, and are expected to ramp up the chip output for UFS and...
Xintec, ShunSin see robust backend orders
Tuesday 8 December 2020Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...
dToF likely to be mainstream 3D depth-sensing technology in 2021
Tuesday 8 December 2020Apple's adopting LiDAR based on dToF (direct time of flight) for iPhone 12 Pro, iPhone 12 Pro Max and iPad (2020) is expected to prompt Android smartphone vendors to follow suit,...
The 'curse' of chip scaling
Tuesday 24 November 2020Moore's Law will continue to be embraced as sort of a faith when it becomes inapplicable, but chiplets will have a chance to become the mainstream in future IC design, according to...
CHPT, Xintec positive about 4Q20 on strong shipments for Apple devices
Tuesday 17 November 2020Taiwan's top test interface specialist Chunghwa Precision Test Tech (CHPT) and TSMC's re-invested backend house Xintec are both optimistic about their revenue prospects for fourth-quarter...
Macronix, Winbond stepping up automotive NAND deployments
Friday 13 November 2020To expand presence in the automotive memory market, Macronix International has disclosed plans to enter volume production of 96-layer 3D NAND memory for automotive applications in...
Micron ships 176-layer 3D NAND flash memory
Tuesday 10 November 2020Micron Technology has begun volume shipments of what the company claims is the world's first 176-layer 3D NAND flash memory.
Top foundries to maintain tight partnerships with OSATs, says Amkor executive
Monday 9 November 2020Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
CHPT, Xintec log big revenue gains on iPhone sales
Wednesday 4 November 2020IC testing solution provider Chunghwa Precision Test Tech (CHPT) and 3D sensor components packager Xintec have posted impressive revenue gains for the first three quarters of 2020...
Altek expects growing adoption of stereopsis-based 3D depth-sensing modules
Thursday 29 October 2020Digital camera ODM and imaging solution provider Altek has developed 3D depth-sensing modules based on stereopsis technology and expects adoption for such modules to begin to increase...
Win Semi expects 1-3% revenue growth in 4Q20
Thursday 29 October 2020GaAs foundry Win Semiconductors expects to post a revenue increase of 1-3% sequentially in the fourth quarter of 2020, with gross margin ranging from 37% to 39%.
Kioxia to build new fab for 3D flash manufacturing
Thursday 29 October 2020Kioxia has announced it will begin to construct a fabrication facility, dubbed Fab 7, at its factory site in Yokkaichi, Japan to expand production of its proprietary 3D flash memory...
Macronix to see 48-layer 3D NAND drive revenue growth in 2021
Tuesday 27 October 2020Macronix International, a supplier of mask ROM and flash memory, expects its in-house developed 48-layer 3D NAND products to start generating revenue in 2021.
SK Hynix to acquire Intel NAND memory biz
Tuesday 20 October 2020Intel and SK Hynix have signed an agreement under which the latter would acquire the former's NAND memory and storage business for US$9 billion, according to the companies.
Win Semi enters LiDAR scanner supply chain for new 5G iPhones
Thursday 15 October 2020GaAs foundry Win Semiconductor and its backend partners including Elite Advanced Laser (eLaser) are engaged in production of VCSEL chips for ToF-based LiDAR scanner for the iPhone...
Innodisk launches 96-layer 3D TLC SSD lineup
Thursday 15 October 2020SSD developer Innodisk has rolled out its new 96-layer 3D TLC device lineup for enterprise and industrial applications, and is gearing up for end-market demand recovery next year.
Win Semi continues to enjoy robust 5G PA, VCSEL demand
Tuesday 29 September 2020GaAs foundry Win Semiconductors continues to enjoy a strong influx of orders for 5G PA and VCSEL components with clear order visibility through the fourth quarter, despite no orders...
Optical filter maker Kingray expanding NBPF capacity for handset 3D ToF modules
Monday 28 September 2020Taiwan's optical filter specialist Kingray Photoelectric Technology is set to expand monthly production capacity for narrow band pass filter (NBPF) for 3D ToF (time of flight) modules...
ASE set to volume produce chip-last FOCoS process in 2021
Thursday 24 September 2020ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
Thursday 24 September 2020TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...