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NEWS TAGGED 28NM
Tuesday 17 May 2022
DDI prices under strengthening downward pressure
LCD display driver IC (DDI) prices, particularly those for handsets, are poised to fall further in the second quarter of 2022, and even handset-use OLED DDI prices are likely to fall...
Monday 16 May 2022
SMIC no longer discloses revenue by process nodes
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has reported first-quater 2022 sales, but omitted a revenue breakdown by manufacturing process nodes...
Friday 13 May 2022
ASMedia transitions to 28nm process for part of chip production
ASMedia Technology, an affiliate of Asustek Computer specializing in high-speed transmission chips, has transitioned to 28nm process manufacturing for part of its chip solutions while...
Thursday 5 May 2022
MediaTek, Realtek seek more available 16nm and 12nm fab capacity
MediaTek and Realtek Semiconductor both continue to strive for more available 16nm and 12nm fab capacity for Wi-Fi core chips, according to industry sources.
Friday 29 April 2022
China firms eyeing close partnerships with TSMC
Xiaomi, Oppo, Bitmain Technologies, and AI processor startup Horizon Robotics are all eyeing close partnerships with TSMC to satisfy their growing demand, particularly that for sub-5nm...
Wednesday 27 April 2022
Pure-play foundries see automotive chip orders continue ramping up
Taiwan-based pure-play foundries continue to see orders for automotive semiconductors ramp up while stepping up their capacity expansion pace, according to industry sources.
Thursday 21 April 2022
Wi-Fi SoC shortages improving
Wi-Fi core chip suppliers have obtained more available fab capacities at foundries, which are experiencing cutbacks in orders from other areas, and therefore are seeing their tight...
Wednesday 20 April 2022
GigaDevice posts profit hike in 1Q22
China's GigaDevice, which specializes in NOR flash memory, has reported net profits surged 126.1% on year to CNY681 million (US$106.5 million) in the first quarter of 2022.
Friday 8 April 2022
Intel CEO visits Taiwan for additional capacity support from TSMC
Intel CEO Pat Gelsinger has made a short visit to Taiwan and met with TSMC in an effort to secure not only sub-7nm process manufacturing capacity but also additional 28nm and other...
Wednesday 6 April 2022
IC foundries, fab toolmakers continue to see orders piling up
TSMC and other Taiwan-based IC foundries including United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) continue...
Friday 1 April 2022
SMIC posts 13% wafer ASP rise in 2021
Semiconductor Manufacturing International (SMIC) saw its gross margin climb to a record high of 30.8% in 2021, when its wafer ASPs rose 13.1% to CNY4,763 (US$749.9) from CNY4,210...
Friday 1 April 2022
Samsung may outsource more OLED DDI production to Taiwan
Samsung Electronics is likely to step up its outsourcing of OLED display driver ICs in 2022 and 2023, with Novatek Microelectronics and other Taiwan-based DDI suppliers being pinpointed...
Monday 28 March 2022
TSMC says production unaffected by COVID lockdown in Shanghai
China has started locking down Shanghai in two phases for mass Covid-19 testing starting today (March 28) amid a resurgence of coronavirus infections. TSMC and other Taiwan-based...
Friday 25 March 2022
Foundries remain aggressive in fab capacity expansions
TSMC, Samsung Electronics, China's SMIC and other foundries are all poised to carry out their aggressive capacity expansion plans, despite heightened macroeconomic uncertainty.
Tuesday 22 March 2022
TSMC to see orders for auto chips ramp up
TSMC is expected to see orders for automotive electronics chips rise at a faster-than-expected pace, according to industry sources.
Tuesday 18 October 2016
Samsung 14nm chips for wearables
Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology. Powered by two Cortex-A53 cores, the Exynos 7270 makes full use of the 14nm process, delivering 20% improvement in power efficiency when compared to its predecessor built on 28nm, and thus notably extending the battery life, Samsung said. By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM radio, and location-based services with GNSS (global navigation satellite system) solutions.
Wednesday 31 August 2016
Samsung 14nm Exynos chips
Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone market as well as other IoT devices. Last year, Samsung adopted advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices. Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 improvements in CPU performance and 30% improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS. Additionally, with design optimization and feature consolidation for components such as PMICs and RF functionalities, Exynos 7570 reduces the total chipset size by up to 20%, giving manufacturers better ability to craft slimmer smartphones, according to Samsung. It supports screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras.
Tuesday 22 March 2016
Samsung 12-megapixel image sensor
Samsung Electronics has announced a 12-megapixel image sensor for smartphones. Already in mass production, this 1.4 micron-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras. Samsung's new image sensor with Dual Pixel technology employs two photodiodes located on the left and right halves of a pixel, while a conventional image sensor dedicates less than 5% of its pixels, with one photodiode each that converts light particles into measurable photocurrent for phase detection. As each and every pixel of the Dual Pixel image sensor is capable of detecting phase differences of perceived light, significantly faster auto-focus has become possible. The image sensor has also adopted Samsung's ISOCELL technology, which isolates the photodiodes in each pixel with a physical wall to further reduce color cross talk, maximizing the image sensor's performance. For top-of-the-line performance while keeping the size to a minimum, the new image sensor is built with cutting-edge chip-stacking technology. The Dual Pixel image sensor stacks a 65nm sensor and 28nm logic chip together to deliver outstanding photo-taking experiences in today's sleek smartphones.
AROUND THE WEB
Russian government's new semiconductor plan: Local 28nm by 2030
Saturday 16 April 2022
May 18, 11:03
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Monday 9 May 2022
HOLTEK launches new 32-bit touch key MCUs – Provides professional technology services and solutions
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Vedanta looking for chip customers in advance
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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