Specialty DRAM and flash memory chipmaker Winbond Electronics expects to ramp up monthly output at its new 12-inch fab in Kaohsiung, southern Taiwan to 10,000 wafers by the fourth...
Specialty DRAM specialist Winbond Electronics plans to advance its second-phase facility construction at its new plant in Kaohsiung, southern Taiwan to ease tight capacity for specialty...
China-based memory foundry ChangXin Memory Technologies (CXMT) is gearing up for its entry into the DDR3 memory market segment with its in-house developed 17nm process technology,...
Winbond Electronics is constructing a new 12-inch wafer fab in Kaohsiung, southern Taiwan, which is scheduled to come online in the first half of 2022, according to the specialty...
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
Chip orders for notebooks are expected to stay robust until the end of the third quarter, according to Arthur Chiao, chairman for specialty DRAM and flash memory maker Winbond Elec...
Specialty DRAM and flash memory chipmaker Winbond Electronics is slowing down constructing and equipping its new 12-inch wafer plant in Kaohsiung, southern Taiwan, according to company...
Specialty DRAM and flash memory maker Winbond Electronics has announced net profit increased 27.9% sequentially to NT$591 million (US$19.3 million) in the third quarter of 2019. EPS...
Taiwan Semiconductor Manufacturing Company's heavy investments in advanced wafer-fab technology are set to pay off significantly for the world's largest silicon foundry as it continues...
Xilinx has announced the expansion of its 16nm Virtex UltraScale+ family to now include what the company claims is the world's largest FPGA, the Virtex UltraScale+ VU19P, with 35...
Specialty DRAM and flash memory chipmaker Winbond Electronics on July 22 held a beam-raising ceremony for its new 12-inch wafer plant in Kaohsiung, southern Taiwan. The new facility...
Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed...
China-based DRAM maker ChangXin Memory Technologies (CXMT) is stepping up DRAM production deployments as it will kick off commercial runs of its production lines by the end of 2019...
The average revenue generated from processed wafers among the four biggest pure-play foundries - TSMC, Globalfoundries, UMC and SMIC - is expected to be US$1,138 in 2018 when expressed...