660 news items tagged 2020
AIMobile partners with Canon to target AI surveillance business
Friday 13 December 2019AIMobile, an AI solution joint venture between Inventec and Advantech, has partnered with Canon to integrate its AI technologies into the Japanese firm's imaging systems to strengthen...
Goodix to ramp up optical in-display fingerprint sensor shipments in 2020
Friday 13 December 2019Goodix Technology is set to ramp up shipments of its optical in-display fingerprint sensors in 2020, and has reportedly reserved sufficient 8-inch fab capacity from TSMC, according...
Gaming monitor panel market likely to see oversupply in 2020
Friday 13 December 2019The supply of gaming monitor panels could exceed market demand in 2020 as a growing number of panel makers are realigning their production lines to focus more on IT panels instead...
USI to acquire Asteelflash
Friday 13 December 2019Universal Scientific Industrial (USI), a member of Taiwan's ASE Technology Holding, has disclosed plans to acquire fellow EMS company Asteelflash for around US$450 million.
IC substrate suppliers see clear order visibility stretch into 2020
Friday 13 December 2019Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...
NARLabs to invest NT$570 million in supercomputer projects in 2020
Thursday 12 December 2019National Center for High-performance Computer under stated-owned National Applied Research Laboratories (NARLabs) is planning to invest NT$570 million (US$18.63 million) in 2020 to...
HP eyeing bigger share in Taiwan notebook market
Thursday 12 December 2019Hewlett-Packard (HP) is looking to expand its share in Taiwan's notebook market in 2020 to a double-digit percentage, according to Wendy Wang, chairman of HP Taiwan.
Backend firms to gain from robust high-spec auto CIS demand
Thursday 12 December 2019Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which...
Foxconn subsidiaries push into 5G businesses
Thursday 12 December 2019Now that Young Liu has taken the helm, the Foxconn Technology Group (Hon Hai Precision Industry) has begun a series of transformations targeting the business opportunity from 5G,...
Taiwan IC design houses see increases in orders for 5G phones
Thursday 12 December 2019Taiwan-based IC design houses have seen significant increases in orders for related ICs for 5G phones recently, particularly from first-tier Chinese handset brands, with the ramp-ups...
Global semiconductor equipment sales to rebound in 2020
Thursday 12 December 2019Global semiconductor manufacturing equipment sales will drop 10.5% to US$57.6 billion in 2019 from last year's historic peak of US$64.4 billion but stage a 2020 recovery and set a...
ASE to see strong 1Q20 with robust 5G mobile SoCs backend orders
Wednesday 11 December 2019Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...
Competition in TWS chip market to heat up in 2020
Wednesday 11 December 2019The global market for SoCs for true wireless stereo (TWS) earbuds is poised for exponential growth in 2020, but competition will heat up, driving IC suppliers to improve their product...
Semicon equipment makers to embrace bright prospects for 2020
Tuesday 10 December 2019With capital expenses by semiconductor firms in Taiwan and China set to regain expansion momentum in 2020, equipment supply chain players are expected to see a bright year for their...
Ibase to cross into energy storage business with Powin and Murata
Tuesday 10 December 2019Taiwan-based IPC maker Ibase Gaming has announced it will partner with US-based Powin Energy and Japan-based Murata Manufacturing to develop energy storage solutions.
Backend partners to gain from Sony CIS capacity expansion in 2020
Tuesday 10 December 2019Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...
Lens demand from China smartphone vendors to surge in 2020
Tuesday 10 December 2019Huawei Tachnologies is expected to ship 200 million smartphones in 2020 and its fellow first-tier vendors, including Oppo, Vivo and Xiaomi, will each ship at least 100 million units,...
AVY expands into automotive component business via Japan affiliates
Tuesday 10 December 2019AVY Precision Technology is expanding its automotive component business to cover products including electric parking braking (EPB) system module and electric vehicle motor, and expects...
Macronix gearing up for 3D NAND flash
Tuesday 10 December 2019Macronix International is poised to kick off commercial shipments of 48-layer 3D NAND flash chips in the second half of 2020, followed by volume shipments of 96-layer 3D NAND products...
TSMC obtains Sony orders for CIS, says report
Tuesday 10 December 2019TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent...
Nuvoton braces for impact from acquiring loss-making business from Panasonic
Tuesday 10 December 2019Acquiring Panasonic's loss-making semiconductor business will have a negative impact on Nuvoton Technology's profitability in the short term, and it may take time for the business...
Advantech to launch MarketPlace 2.0 modularized services
Monday 9 December 2019Advantech will release MarketPlace 2.0 under its WISE-PaaS (platform as a service) in January 2020 to allow clients to customize software services they need.
Winbond slowing down new fab construction
Monday 9 December 2019Specialty DRAM and flash memory chipmaker Winbond Electronics is slowing down constructing and equipping its new 12-inch wafer plant in Kaohsiung, southern Taiwan, according to company...
LTCC to be mainstream packaging material for mmWave modules
Friday 6 December 2019The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...
MediaTek, Realtek to ramp Wi-Fi 6 chip output in 2020
Friday 6 December 2019MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.
- Apple's rumored Mini-LED iPad and MacBook Pro could arrive in 2020 (Dec 2) - The Verge
- AMD graphics developers are calling their next card the Nvidia Killer (Aug 12) - Digital Trends
- Power outage may have ruined 15 exabytes of WD and Toshiba flash storage (Jul 1) - Apple Insider
- Dialog expects to supply chips to Apple through 2020: CEO in paper (Mar 3, 2018) - Reuters
- Apple is working on a 'foldable' iPhone for release in 2020, says Bank of America (Mar 23, 2018) - CNBC
- AMD's leaked road map shows plans for Ryzen, Threadripper processors until 2020 (Mar 9, 2018) - Digital Trends
- Dialog expects to supply chips to Apple through 2020 - CEO in paper (Mar 3, 2018) - NASDAQ.com
- China forecast to miss chip targets (Jan 26) - EE Times
- Beyond 7nm - the race to 4nm is Samsung's to lose (Nov 16) - Andorid Authority
- Apple acquired augmented reality headset startup Vrvana for US$30 million (Nov 21) - TechCrunch