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NEWS TAGGED 12-INCH WAFER
Wednesday 4 August 2021
Taiwan backend houses bracing for robust China mature-node chips demand
Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...
Monday 19 July 2021
Chip probing houses to gain from new iPhone SE series, say sources
Apple reportedly is set to roll out its third-generation iPhone SE series in the first half of 2022, providing new business opportunities for chip probing specialists including TSMC...
Friday 16 July 2021
Intel GF buyout unlikely, sources say
Intel's acquisition of Globalfoundries is unlikely, as GF's manufacturing capability that is more focused on mature and specialty process technology contradicts Intel's ambition of...
Wednesday 7 July 2021
TSMC under US pressure over expansion at China fab
TSMC is coming under pressure from the US over its plan to expand foundry capacity in China, according to industry sources.
Wednesday 7 July 2021
China foundry completes fundraising for capacity expansion
China-based CanSemi Technology has raised funds to carry out its upcoming capacity expansion project, in which the specialty IC foundry will add an additional 20,000 12-inch wafers...
Monday 28 June 2021
Foundries accelerating 28nm process capacity expansions
Foundries including TSMC and UMC, and China's SMIC, have all stepped up their capacity expansions particularly for 28nm process, according to industry sources.
Friday 25 June 2021
Huawei to run foundry biz
Huawei will set up its first wafer fab in Wuhan, China's Hubei province, with production expected to kick off in phases starting 2022, according to industry sources.
Wednesday 23 June 2021
Globalfoundries breaks ground for new fab in Singapore
Globalfoundries on June 22 broke ground for a new 12-inch wafer fab at its Singapore campus, according to the pure-play foundry.
Tuesday 15 June 2021
PSMC negotiating orders for 2023
Taiwan-based pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) continue to see orders demanding 8- and 12-inch wafer fabrication services pull in, and is in talks with...
Monday 7 June 2021
Winbond to see profit more than double in 2Q21
Rising specialty DRAM and NOR flash memory prices are set to boost net profits at Winbond Electronics in the second quarter of 2021, which are likely to more than double those generated...
Tuesday 25 May 2021
Pure-play foundries expanding capacity with prepayments from clients
TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Wednesday 5 May 2021
Rising ASPs to boost Nanya, Winbond 2Q21 revenues
Memory chip makers Nanya Technology and Winbond Electronics will see their revenues boosted by rising ASPs in the second quarter, according to industry sources.
Monday 3 May 2021
TSMC ramping 28nm chip output despite cutback in orders from Sony
Despite weakened orders from Sony, TSMC still has been ramping up its 28nm chip output with plans to build additional production capacity at its Nanjing fab in China, according to...
Thursday 29 April 2021
VIS to buy AUO fab for NT$905 million
Specialty IC foundry Vanguard International Semiconductor (VIS) has announced plans to take over the L3B plant of LCD panel maker AU Optronics (AUO), and related equipment and facilities,...
Wednesday 30 March 2016
Winbond SpiStack memories
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The Winbond SpiStack W25M series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. Winbond's stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory. Winbond's SpiFlash memory devices are manufactured at the company's 12-inch wafer fabrication facility in Taichung, Taiwan.
Aug 2, 09:16
iCatch Technology launches 4K AI smart tracking video conferencing dual camera solution
Thursday 29 July 2021
Veeam continues streak as leader in 2021 Gartner Magic Quadrant for enterprise backup and recovery software solutions
Friday 23 July 2021
Chenbro launches the RM252/RM352 series server chassis to empower small base stations deployment in telecommunications
Tuesday 13 July 2021
MOBI standards guide innovation in blockchain services for growth in smart mobility industry
TSMC, Amkor to process IPD chips for new Apple devices
Apple to sharply up components pull-ins for new iPhones in 2H21
Testing houses to see strong 1Q22
Notebook brand companies remain positive about 2022
Enterprise notebooks to become key growth driver in 2022
China smartphone vendors see combined shipments fall in 2Q21
Taiwan small- to mid-size LCD panel shipments to slip in 3Q21
China smartphone AP shipments to grow 7% in 3Q21
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