SEMI, Foxconn Technology and UMC have jointly released the SEMI Auto IC Master program designed to provide complete automotive chip solutions through effective and close partnerships with Taiwan automotive semiconductor supply chain, facilitate deployments in global car chip market, and promote R&D of innovations by automakers.
SEMI Taiwan president Terry Tsao said lingering shortage of automotive chips is accelerating the transformation of the entire car supply chains, and automakers have to intensify their cooperation and alliance with semiconductor and other high-tech supply chains to secure sufficient capacity supply and accelerate their development of innovative solutions.
Foxconn chairman Young Liu said the Auto IC Master platform focuses on the IC segment and its MIH platform highlights the integration of components modularization and standardization, both complementing each other using collective efforts to create maximum synergies in serving global automotive OEM makers.
Liu continued that chips are the brain of a car and if the Auto IC Master can help roll out the best chips, it means the car will have the best brain to smartly control the CASE (car networking, autonomous driving, shared services and electrification) operations, which is a market segment that can be tapped with existing advantages of Taiwan's semiconductor industry.
He stressed that Taiwan as an important semiconductor hub in the world has gathered top talent and created extremely high output values, and is in pole position to gain from the ongoing raging development of new energy vehicles worldwide by providing diverse automotive chips.
UMC honorary vice chairman John Hsuan also noted that future vehicles will demand many more chips, with one electrical vehicle using over 250 chips, compared to 40 for a traditional oil-fuel car, and that Taiwan semiconductor players should join forces to create an integrated ecosystem through the Auto IC Master initiative to tap immense business opportunities.
Actually, Taiwan's players in diverse semiconductor segments, including foundry, backend processing, IC design, and even leadframe, probe card and PCB have all set automotive applications as their main growth driver in the future, according to industry sources. And major foundries including TSMC, UMC and VIS, as well as leading IC design houses Novatek Microelectronics and Realtek Semiconductor have all become important members of global automotive semiconductor supply chains, the sources said.
TSMC, for instance, has landed substantial chip production orders for a joint-venture EV brand between Sony and Honda, and it also continues to fabricate automotive chips for IDMs including Infineon, NXP, Renesas, TI and STMicroelectronics. UMC and VIS have also indicated that their revenue contribution ratios for automotive chips are rising steadily.
Meanwhile, Realtek has captured orders for its car-use Ethernet chips from Tesla, Hyundai Motor, Mercedez-Benz, BMW, Honda and Toyota, and Novatek has also joined the supply chain of BMW EVs with its automotive chips, the sources said.
Taiwan's makers of diodes, MOSFETs, leadframes and other components have also seen their deployments in automotive applications, including Actron Technology, Panjit International, Eris Technology, SDI, Chang Wah Technology, all expected to enjoy more growth momentum under the support of Auto IC Master and MIH platforms, the sources said.