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TSMC fan-out packaging to attract orders for Android smartphone SoCs

Julian Ho, Taipei; Jessie Shen, DIGITIMES 0

Credit: DIGITIMES

Apple will no longer be the exclusive customer of TSMC adopting the foundry's advanced integrated fan-out (InFO) wafer-level packaging, which is expected to attract orders for Android smartphone application processors (AP) by 2024, according to industry...

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