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Foxconn to make SiC components at 6-inch fab for EV, solar apps

Julian Ho, Taipei; Willis Ke, DIGITIMES 0

Credit: DIGITIMES

Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors and kick off the development of GaN devices.

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