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Kinsus to expand ABF substrate capacity by 30% in 2021
Jay Liu, Taipei; Willis Ke, DIGITIMES 0

Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates aiming to expand the company's overall ABF substrate production...

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Bits + chips Passive, PCB, other IC components
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5G capacity capacity expansion Chunghwa Picture Tubes flexible PCB Flexium FPCB IC IC substrate joint venture Kinsus Nvidia PCB Pegatron plant substrate Taiwan Xilinx
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Chunghwa Picture Tubes Flexium Interconnect Kinsus Interconnect Technology Pegatron