Bits + chips
Chipbond to expand backend capacity for RF, PA devices, driver ICs
Julian Ho, Taipei; Willis Ke, DIGITIMES

Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Login to continue
  • Save my User ID and Password

    Save my User ID and Password

    Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

    Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

  • NEW users please register first.
Supply chain
Disconnected ICT Supply Chains: New Power Plays Unfolding
Research insights
  1. UWB application is on rise, says Digitimes Research
  2. Low-temperature operating problem for EV-use batteries solvable, says Digitimes Research
  3. Depth sensors keys in robot navigation, says Digitimes Research
Global LCD panel shipment forecast, 2021 and beyond
This website adheres to all nine of NewsGuard's standards of credibility and transparency.
© 2021 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.