Displays
Corning to showcase R&D innovations at 2020 Taiwan Innotech Expo
Rodney Chan, DIGITIMES, Taipei

Corning has announced it will exhibit technologies from its latest R&D innovations at the 2020 Taiwan Innotech Expo (TIE), one of the largest invention fairs in Asia, beginning September 24.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.