中文網
Taipei
Mon, Oct 18, 2021
11:49
mostly cloudy
26°C
CONNECT WITH US
TSMC, Samsung scaling up competition in advanced chips packaging
Monica Chen, Taipei; Willis Ke, DIGITIMES 0

TSMC and Samsung Electronics have seen their competition significantly heat up in advanced packaging technologies beyond foundry processes, which could eventually dent business opportunities for traditional backend houses such as ASE Technology, Siliconware...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories