中文網
Taipei
Sat, May 21, 2022
10:17
partly cloudy
24°C
CONNECT WITH US

TSMC to issue NT$13.9 billion bonds to fund capacity expansion

Jessie Shen, DIGITIMES, Taipei 0

The board of directors of Taiwan Semiconductor Manufacturing Company (TSMC) has approved plans to issue NT$13.9 billion (US$471.7 million) in unsecured bonds to help purchase new equipment and facilities for capacity expansion, according to the world's...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories